-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
TTM Technologies Announces the Retirement of its CFO and Appoints a CFO Successor
August 4, 2023 | TTM Technologies, Inc.Estimated reading time: 2 minutes

TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), announced that Todd B. Schull, the Company’s Chief Financial Officer, intends to retire at the end of 2023.
Mr. Schull has also notified the Company of his intention to step down as the Company’s Executive Vice President & Chief Financial Officer, effective September 11, 2023. From September 11, 2023 to December 31, 2023, Mr. Schull intends to serve as a special advisor to the Company’s Chief Executive Officer, Thomas T. Edman.
In addition, the Company announced today that Daniel L. Boehle, age 51, has been appointed to succeed Mr. Schull as Executive Vice President and Chief Financial Officer of the Company, with a projected effective date of September 11, 2023. Mr. Boehle is expected to join the Company on August 21, 2023. From August 21, 2023 to September 11, 2023, Mr. Boehle is expected to serve as Executive Vice President of Finance for the Company.
Mr. Boehle has served as Vice President and Chief Financial Officer for Aerojet Rocketdyne Holdings, Inc. (“Aerojet”), a world-recognized technology-based engineering and manufacturing company that develops and produces specialized power and propulsion systems, as well as armament systems, since August 2020. From August 2017 to July 2020, Mr. Boehle was Vice President, Controller, and Chief Accounting Officer for Aerojet. Before joining Aerojet, Mr. Boehle served in various leadership roles across Corporate Accounting, Financial Reporting, and Financial Planning and Analysis at Northrop Grumman Corporation. Before joining Northrop Grumman Corporation, he held positions at KPMG LLP and KPMG Australia Ltd. Mr. Boehle has a B.S. in Accounting from Loyola Marymount University and a Master of Business Administration with an Emphasis in Finance and Entrepreneurship from the UCLA Anderson School of Management.
“Today we reflect on the past and embrace the future. I would like to thank Todd Schull for his 10 plus years of service to TTM and congratulate him on his sterling career. I speak for all of the TTM family as we wish him immense joy and fulfillment in his retirement. I am grateful for his leadership and friendship and will always cherish the invaluable contributions he made to TTM and his partnership with me. While we honor Todd for his career as he approaches retirement, we welcome Dan with excitement and open arms. I am confident that with Dan’s experience and expertise, he will help us to continue to forge a path of excellence as we execute on our core vision of inspiring innovation as a global preeminent technology solutions company,” said Tom Edman, TTM’s Chief Executive Officer.
Suggested Items
WISE Partners with TTM Technologies for Syracuse uHDI Manufacturing Facility
03/04/2025 | TTM Technologies, Inc.TTM Technologies (“TTM”) has selected WISE as a key partner and exclusive supplier of horizontal wet process machines for its new ultra-high-density interconnect (“uHDI”) PCB manufacturing facility in Syracuse, NY.
TTM Technologies Announces Chief Operating Officer Transition
02/18/2025 | Globe NewswireTTM Technologies, Inc. announced that in a planned succession change, James P. Walsh (Jim) will assume the role of Chief Operating Officer beginning July 1, 2025 and Philip Titterton (Phil), TTM’s current Chief Operating Officer, will take on an advisory position for the foreseeable future with TTM and assist with special operations projects.
TTM Technologies Honors Community Service with the 2024 TTM Chair of Community Service Award
01/14/2025 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCB”s), is pleased to announce the presentation of the 2024 TTM Chair of Community Service Award to: the TTM Zhongshan Volunteers Association.
TTM Technologies Introduces Innovative Radio Frequency Components for Telecom Band n104 to Enhance 5.5G Applications
12/12/2024 | Globe NewswireTTM Technologies, Inc. has expanded its Radio Frequency and Specialty Components (RF&S) product offering by releasing a family of components supporting telecom band n104, an emerging band extension for 5.5G applications.
TTM Technologies to Exhibit at the 2024 International Electronics Circuit Exhibition in Shenzhen, China
12/04/2024 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs), announces that it will exhibit at the 2024 International Electronics Circuit Exhibition (Shenzhen).