Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
TSMC to Build Multi-Billion-Euro Chip Factory in Germany
August 9, 2023 | PRNewswireEstimated reading time: 1 minute
Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.
The volume of its Dresden expansion will be at least EUR 10 billion. The new plant for 300-millimeter semiconductors will be located in the heart of the electronics hub often known as "Silicon Saxony." The German government and the EU will reportedly offer major financial support for the project, pending EU approval.
The planned factory will have a monthly capacity of 40,000 wafers. Construction is scheduled to start in the second half of 2024, with the facility to go operational by the end of 2027. Bosch, Infineon and NXP are also participating in the project, with ten percent each.
The plant's products will be aimed primarily at the European and German automotive and industrial sectors, said TSMC. The project follows upon similar expansions by German chipmaker Infineon in Dresden and US giant Intel in Magdeburg, also in eastern Germany.
"With TSMC's investment, a further global player in the semiconductor industry is coming to Germany," said Minister for Economic Affairs and Climate Action Robert Habeck in a statement. "It shows that Germany is an attractive, competitive location, particularly for key technologies like microelectronics."
Germany Trade & Invest (GTAI), the German government agency for international business promotion, was involved in the initial consultations that led to the TSMC expansion.
"Among the many advantages of Germany as a chipmaking location are its European-leading automotive industry and the availability of clean forms of energy, which will become increasingly important to international companies in the years to come," says GTAI CEO Robert Hermann. "This new expansion is a fantastic contribution to Silicon Saxony and the German economy as a whole. It will surely stimulate further opportunities for international businesses in Europe's largest economy."
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Automation Meets Sustainability
09/08/2025 | Rick Nichols, GreenSource EngineeringGreenSource Engineering (GSE) is proud to have contributed to the first successful reshoring of a PCB facility on a greenfield site in the United States. While we are honored to have played a key role, full credit for this achievement goes to SEL for its vision, commitment, and professionalism.
Japan’s OHISAMA Project Aims to Beam Solar Power from Space This Year
07/14/2025 | I-Connect007 Editorial TeamJapan could be on the cusp of making history with its OHISAMA project in its quest to become the first country to transmit solar power from space to Earth, The Volt reported.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.