-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Experts to Present at SMTA High Reliability and Conformal Coating Conference
August 10, 2023 | Indium CorporationEstimated reading time: 2 minutes

The upcoming SMTA High Reliability Cleaning and Conformal Coating Conference, taking place August 29-31 in Dallas, Texas, U.S., will feature presentations by two Indium Corporation experts. Both presentations will take place on August 31.
First, Global Head of e-Mobility and Infrastructure Brian O’Leary will participate in a keynote panel presentation titled Strengthening e-Mobility Infrastructure: Overcoming High-Voltage and Environmental Challenges.
The recently introduced U.S. standard requiring 97% up-time performance, combined with the global expectations of consumers and fleet operators for robust and durable EV infrastructure capable of withstanding harsh outdoor conditions, is driving manufacturers to develop weather-resistant, corrosion-resistant, and outdoor-friendly solutions with advanced features. This technical presentation will explore the critical elements of producing e-Mobility modules and the difficulties in maintaining reliability and durability under high voltage, current, and temperatures in electric vehicles and charging stations.
Later in the afternoon, Technical Support Engineer Matt Gruber will deliver a presentation titled A Sustainability Look at a Reliable Low-Temp Process.
Reducing energy consumption is of increasing interest in SMT assembly industries for both cost and sustainability initiatives. However, despite new demands on manufacturers, reliability expectations remain and, in many sectors such as Healthcare and Automotive, have increased. Gruber will examine the energy-saving potential of compounding reflow and cleaning process modifications in circuit board manufacturing. He will also evaluate the assemblies for surface insulation resistance (SIR) and ionic contamination with the goal of providing manufacturers with confidence and guidelines for low-temperature soldering and cleaning implementation.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, and battery energy storage systems. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on electronics manufacturing and currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, O’Leary co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.
Gruber is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. With more than 30 years of experience as a Manufacturing Engineer, he is a subject matter expert for solder integrity, root cause analysis, and problem resolution. Gruber attended the University of Texas at Dallas where he obtained his bachelor’s degree in electrical engineering. He is a Certified IPC Specialist, and a Certified SMT Process Engineer (CMTPE).
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.