Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
Aspocomp Starts Change Negotiations on Possible Temporary Layoffs at its Oulu Plant
August 15, 2023 | AspocompEstimated reading time: Less than a minute
Aspocomp starts change negotiations on possible temporary layoffs at its Oulu plant in Finland. On August 15, 2023, Aspocomp has issued a negotiation proposal in accordance with the Act on Cooperation to start change negotiations for production-related and financial reasons at its Oulu plant. The majority of the Oulu plant’s approximately 120 production blue-collar employees are covered by the negotiations. The change negotiations are estimated to last two weeks, and the possible temporary layoffs would last a maximum of 90 days.
With the change negotiations, the company prepares for a possible partial adjustment of production to correspond to temporarily low delivery volumes. Slower-than-expected recovery of the semiconductor cycle and high inventory levels in various parts of the value chain has slowed down net sales. A temporary slowdown in the semiconductor cycle is typical for the industry. The industry's long-term growth prospects are still strong. The cycle of the semiconductor industry is expected to return to growth at the end of the year or the beginning of 2024.
Share on:
Suggested Items
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.
IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President
04/16/2025 | IPCIPC, the global electronics association, announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth.