Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
The Knowledge Base: Cultivating Your Brand in the Age of Connection
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 2
Incap Supports Innokas Programming, Robotics Tournament
August 21, 2023 | IncapEstimated reading time: 1 minute
Incap Corporation is proudly sponsoring the Innokas programming and robotics tournament. Our collaboration revolves around inspiring and nurturing the minds of future talents who are interested in technology.
The core focus of this partnership is to support the organisation of the Innokas tournament, a dynamic platform that encourages children and youth to explore technology, programming, and robotics. This aligns perfectly with our belief in nurturing curiosity and creativity from an early age.
“As a listed stock company in Finland, we are dedicated to supporting initiatives that positively impact our country’s youth. This partnership embodies our belief in the potential of young minds and the future they hold for both Finland and the world,” said Otto Pukk, CEO & President of Incap Corporation.
The tournament features engaging contests like XSumo, Rescue, Dance/Theater, Freestyle, and GameDev. These challenges are designed not just to test skills, but to foster critical thinking and problem-solving abilities – essential skills for the 21st century.
Regional tournaments, organised by dedicated coordinators, pave the way to the national event. It’s a journey that culminates in May 2024, where participants from different corners of Finland gather to showcase their talents.
The legacy of the Innokas tournament speaks volumes. Since its inception in 2003, hundreds of young individuals have embraced its spirit. This event stands as a testament to the impact of nurturing young talent. Incap Corporation’s support goes into coordinating the entire tournament, facilitating regional and national events, and aiding contestants’ travel arrangements for the finals.
We are committed to fostering innovation and education. As we embark on this journey with Innokas, we invite you to witness the power of youthful ingenuity. This partnership isn’t just about today; it’s about shaping a better future for all of us.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
07/31/2025 | UCLA NewsroomA new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA.
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,