Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

FuriosaAI Closes $125M Investment Round to Scale Production of Next-Gen AI Inference Chip

07/31/2025 | BUSINESS WIRE
FuriosaAI, a semiconductor company building a new foundation for AI compute, today announced it has completed a $125 million Series C bridge funding round. The investment continues a period of significant momentum for Furiosa as global demand for high-performance, efficient AI infrastructure soars.

SES AI Accelerates Timeline for Revenue Growth and Profitability with Acquisition of UZ Energy

07/31/2025 | BUSINESS WIRE
SES AI Corporation, a global leader in the development and manufacturing of AI-enhanced high-performance Li-Metal and Li-ion batteries, today announced it has executed a definitive agreement to acquire 100% of UZ Energy, an energy storage systems (“ESS”) provider, for a purchase price of approximately $25.5 million, subject to earnout adjustment based on the achievement of specified financial targets.

Semiconductors Get Magnetic Boost with New Method from UCLA Researchers

07/31/2025 | UCLA Newsroom
A new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA. 

Solving the Toughest BGA Challenges in Electronics

07/30/2025 | Nash Bell, BEST Inc.
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.

Aeva, LG Innotek form Strategic Collaboration to Bring Next-Generation Perception Platform to Market

07/29/2025 | BUSINESS WIRE
Aeva, a leader in next-generation sensing and perception systems, announced a broad strategic collaboration with LG Innotek, a manufacturer of cutting-edge technology and an affiliate of the LG Group.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in