-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Book Excerpt: 'The Printed Circuit Assembler’s Guide to... Process Control,' Chapter 2
August 22, 2023 | I-Connect007Estimated reading time: 1 minute

Excerpt from: The Printed Circuit Assembler’s Guide to...Process Control
Chapter 2: Objective Evidence—The Simple and Convenient Route
SIR Testing
Firstly, and most importantly, work by the standards; they make it easier for you. They have been created for your benefit by a group of respected experts. If you are considering SIR testing, whether using a test house or setting up an in-house facility, then the following complementary documents are essential reading:
- IPC-WP-019B: An Overview on Global Change in Ionic Cleanliness Requirements—revised and published in 2020
- IPC-9201A: Surface Insulation Resistance Handbook
- IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing
- Electrochemical Performance Using the IPC-B-52 Test Assembly
- IPC-9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
- IPC-TM-650: Method 2.6.3.7.1 is in DRAFT, but the GEN3 original is included, unfinished, at the back of this book as useful reference material
In addition, there are these following International Standards from the International Electrotechnical Committee (IEC):
- IEC TR 61189-5-506:2019 General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
- IEC 61189-5-501:2021 General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes
- IEC 61189-5-502:2021 General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
- IEC 61189-5-504:2020 General test methods for materials and assemblies. Process ionic contamination testing (PICT)
- IEC TR 61191-9 ED1:2023 Printed board assemblies—Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications—Best practices
Using standards ensures that there is a common global measurement platform that helps catch technical errors, determines quality compliance and, thereby, reduces risk when bringing a new product to market. As can be seen in the two lists above, IPC does not have a stand-alone test method for SIR testing of assemblies. In IPC, one must refer to the guidance documents IPC-9202 and IPC-9203. The only international test standard is the IEC 61189-5-502:2021. To remedy this, GEN3 have submitted a new draft test method to IPC. (See Annex at the end of this book.)
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.