-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Unlock the Future of Electronics Manufacturing: Gen3 and Zestron Workshop
August 22, 2023 | Gen3Estimated reading time: 2 minutes

Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6th, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.
In today's dynamic electronics manufacturing landscape, the reliability of surface components plays a pivotal role in ensuring product quality and longevity. This workshop offers an exclusive opportunity for engineers specializing in process technology and quality assurance to delve into the latest advancements and methodologies in the realm of electronics assembly surface reliability.
The joint seminar will feature presentations from both Gen3 and Zestron, with topics that include:
Zestron Presentations:
- Humidity Robustness: Explore the nuances of failure mechanisms in low and high voltage areas and gain insights into how process technology can mitigate these challenges.
- Coating Reliability: Discover the utilization of advanced quality quick tests to secure the reliability of coatings, ensuring product integrity and performance.
Gen3 Presentations:
- Objective Evidence Approach: Embrace a fresh perspective on meeting the exact standards and requirements of manufacturing processes, paving the way for enhanced process validation and production efficiency.
- Utilizing SIR and Process Ionic Contamination Testing: Dive into the application of Surface Insulation Resistance (SIR) and Process Ionic Contamination Testing for establishing reliable manufacturing processes.
The workshop's comprehensive program addresses the significant impact of surface reliability on electronics assembly quality while offering systematic approaches to identify, mitigate, and validate production processes. By shedding light on potential failure mechanisms and their root causes, engineers will gain valuable insights into producing cleaner, more reliable electronics assemblies.
For professionals seeking to optimize their electronics manufacturing processes and bolster product quality, this workshop promises a wealth of insights and practical knowledge. Join Gen3 and Zestron on September 6, 2023, to be part of this transformative learning experience.
CEO of Gen3, Andy Naisbitt, commented ‘Attending a workshop on objective evidence and the reliability of electronics is crucial in today's rapidly advancing industry. As electronics play an ever-expanding role in our lives, understanding how to assess and ensure their reliability becomes paramount. This workshop offers an opportunity to learn about robust methodologies for evaluating electronic systems. Our workshop can provide you with the ability to make informed decisions based on objective evidence, attendees can contribute to building and utilizing electronics with increased dependability, discovering innovation, and enhancing user experiences.
For more information about Gen3 and its innovative testing solutions, visit GEN3 Systems.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.