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3D Electromagnetic Analysis
August 22, 2023 | Yuriy Shlepnev, SimberianEstimated reading time: 1 minute
Data rates in PCB interconnects are increasing in all signaling protocols (PCIe, DDR, GDDR, Ethernet, USB, SAS, InfiniBand, CEI, OIF, 5G). Most of those high-speed signaling standards have one-lane data rates over 6 Gbps (GT/s) and some up to 112 Gbps with signal spectrum in microwave and even millimeter wave bandwidths. Design of compliant interconnects at these data rates cannot simply rely on geometrical rules or rules of thumb. Signal distortion by reflections, dissipation and crosstalk can cause interconnect performance degradation or even failure. To avoid it, signal integrity compliance analysis and possible interconnect optimization is required.
Our software provides 3D electromagnetic analysis of PCB and packaging interconnects. It can be used for pre-layout design (stackup exploration, via hole design) and post-layout interconnect compliance analysis and optimization. Simbeor ensures the accuracy of the models by using advanced algorithms for 3D full wave analysis, benchmarking, and experimental validation. Simbeor and the “sink or swim” interconnect design process remove all uncertainties and guarantee the first pass design success. Most importantly, it lets you solve electromagnetic signal integrity problems at a relatively low cost and with extreme ease. You don't need to be an expert in signal integrity or have a PhD in electromagnetics to use it.
The first version was introduced in 2007. It was the first electromagnetic tool designed specifically for PCB designers and signal integrity engineers. Since then, its evolution is a chain of innovations in interconnect analysis and validation. In the past three years, with the major part of the work completed in "self-isolation," our team has elevated the tool to a new level.
Our software development kit was introduced for design exploration, machine learning, and for possible integration into other tools. Post-layout geometry processing, visualization and model building were accelerated orders of magnitude. Electromagnetic analysis was also accelerated orders of magnitude with the domain decomposition technique. We had enough time—there were very few distractions—and sufficient expertise to re-think and re-design the post-layout process, making it suitable not only for SI engineers, but for any PCB designer.
To read this entire article, which appeared in the August 2023 issue of Design007 Magazine, click here.
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