Dr. Jennie Hwang, Dr. George Karniadakis to Present at SMTA International

Estimated reading time: 4 minutes

Dr. Jennie Hwang & Dr. George Karniadakis to address “Artificial Intelligence—Opportunities, Challenges & Possibilities” (PDC 1) at SMTA International on Monday, October 9, 2023 at the Minneapolis Convention Center, Minneapolis, MN; Dr. Hwang also to instruct the course on: “Solder Joint Reliability—Principle and Practice” (PDC 4) on Tuesday, October 10.

PDC 1: “Artificial Intelligence – Opportunities, Challenges & Possibilities”
As moving into Artificial Intelligence (AI) era, the explosion of new AI tools and platforms is remaking our daily lives and every aspect of workplace including research, engineering, design, manufacturing and management across all industries from semiconductor and printed circuit board design to life sciences and new material design. Even not being an AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace.

In light of the transformative potential of AI technologies, this short course offers a holistic overview of AI with the goal to spur innovative ideas and inspire new vistas to capitalize the sound benefits of AL and maximize on-job efficiency and effectiveness.

The recent emergence of OpenAI's GPT, Generative AI and conversational AI makes the awareness of the development of AI-related products, use cases and “possible” future become more crucial to the on-job performance. All industry sectors are expected to reorient around AI; the ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course will map out AI landscape including manifold perspectives on the current and future of AI development and deployment. The key components behind the AI technologies including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, predictive modeling and ChatGPT-led AI boom will be outlined. AI with justified confidence and trust will also be highlighted.

Topics:

• Background & diverse perspectives on AI
• Current state of AI
• AI—justified confidence
• AI—machine learning, deep learning, digital twin, IoT and use cases
• Generative AI, OpenAI—ChatGPT
• Diffusion models, how transformers work
• Scientific Machine Learning and examples in Industry applications
• Modeling / simulation, digital twin—use cases
• Deep learning NN architectures and expressive programming frameworks
• AI - Uncertainty Quantification
• New technologies—SNN, dynamic reasoning, continual learning (multitasking)
• Global leaders & competitiveness - examples
• AGI - Artificial General Intelligence
• Brain, mind and intelligence
• Future of AI
• Concluding remarks.

Who Will Benefit:

Co-speakers, Dr. Jennie Hwang (Chair of AI Committee of the National Academies and External Review Panel member of NSF National AI Institutes, as well as a pioneer and long-standing leader in Surface Mount Technology/Manufacturing and lead-free electronics implementation) and Dr. George Karniadakis (a top authority on digital twin, AI and physics-informed neural networks), bring broad-based knowledge and deep predictive modeling expertise to this course.

The course provides working knowledge and integrated overview to help make informed decisions about how to navigate into the future of AI, suitable to all who are interested in staying in the knowledge zone for professional fulfillment including designers, researchers, managers, production, quality and reliability professionals, executives, and business decision makers; also designed for those who desire broad-based information with holistic perspectives on AI.

PDC 4: “Solder Joint Reliability—Principle and Practice”

The reliability of solder joint interconnections in chip level, packaging level and board-level is crucial to the end-use product reliability—when a single one solder joint fails, the product fails. As the number of solder interconnections continues to increase and the volume of each solder interconnection continues to become smaller, the assured solder joint integrity is paramount.

Emphasizing on practical, working knowledge, yet balanced and substantiated with science, the course provides a holistic view of the important aspects of solder joint reliability including the critical “players” (e.g., manufacturing process, PCB/component coating/surface finish, solder alloys). Fundamentals in fatigue and creep damage mechanisms (via ductile, brittle, ductile-brittle fracture), and the likely solder joint failure modes (e.g., interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface cracks) will be highlighted.

To withstand harsh environments, the strengthening metallurgy to optimize stress vs. strain relationship and to further increase fatigue and creep resistance will be outlined. The power of metallurgy and its ability to anticipate the relative performance will be illustrated by contrasting the comparative performance vs. metallurgical phases and microstructure.

The parameters to be considered to derive a universal prediction model and whether existing life-prediction models can assure reliability will be highlighted.

A relative reliability ranking among commercially available solder systems including newer lead-free alloys (coined “Low Temperature Solder”), doped and other solder alloys, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined.

Main Topics:

1. Premise – what is reliability? What are critical players?
2. Significance of solder alloy’s stress vs. strain relationship vs. solder joint integrity;
3. Solder joint fundamentals;
4. Solder joint failures;
5. Solder joint failure mechanisms—ductile, brittle, ductile-brittle transition fracture;
6. Solder joint strengthening metallurgy;
7. Solder joint voids vs. reliability—effects, criteria;
8. Solder joint surface-crack –causes, effects;
9. Distinctions and commonalties between Pb-free and SnPb solder joints;
10. Thermal cycling conditions—effects on test results and test results interpretation;
11. Testing solder joint reliability—discriminating/discerning parameters;
12. Life-prediction model vs. reliability;
13. Solder joint performance in harsh environments;
14. “Low Temperature Solder” and SnCu+ x, y, z and SnAgCu + x, y, z systems with dopants;
15. Best practices and competitive manufacturing.

Who Should Attend:
Dr. Hwang, a pioneer and long-standing pioneer in SMT manufacturing and lead-free implementation, brings deep knowledge and broad experience to this course through both hands-on and advisory capacities in commercial as well as military applications. Her comprehensive knowledge has solved the toughest reliability and production issues. The course provides working knowledge and pragmatic perspectives to all who are concerned about the solder joint reliability or interested in understanding the solder joint reliability, including designers, quality, manufacturing and reliability professionals, researchers, managers, and business-decision makers; the course is also designed for those who desire obtaining the broad-based understanding of the subject.