Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
Hyundai Mobis, Autotalks Collaborate to Implement Cutting-edge V2X Technology for Connected Cars
August 28, 2023 | PRNewswireEstimated reading time: 1 minute
Hyundai Mobis, a leading global automotive supplier and Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions are set to unveil their latest joint effort: Hyundai Mobis' MTCU (Multi-functional Telematics Control Unit) connectivity modules.
MTCU Gen1, Hyundai Mobis' most advanced connectivity module to date, supports Day-1 V2X services in all geographies. Powered by Autotalks' V2X chipset, the MTCU Gen1 sets the standard for high-performance, globally compatible automotive V2X. Day-1 applications alert drivers in dangerous, non-line-of-sight situations, for example to avert a possible collision with a vehicle or bicycle at an intersection. Additional applications include alerts about road hazards.
As the demand for V2X continues to grow, primarily driven by the global NCAP roadmap, Hyundai Mobis selected Autotalks' 3rd generation chipset to power its next-generation connectivity module solution, MTCU Gen2. The module, expected to be available in 2024, will enable car manufacturers to offer advanced safety applications based on V2X communication.
MTCU Gen2 enables a range of use-cases from basic Day-1 to advanced Day-2 V2X applications. This is achieved through its inherent support for the latest global V2X standards, dual-channel operation, and the integration of Functional Safety-grade implementation, enabling car actuation based on V2X data.
The MTCU Gen1 module will be showcased at the upcoming IAA Mobility exhibition, which will take place in Munich, Germany, between September 5th and September 10th, 2023. Hyundai Mobis will display its latest technical advancements and provide visitors with a glimpse into the future of connected-car user experiences at booth # B2 Hall D20.
Share on:
Suggested Items
Transforming the Future of Mobility: DuPont Unveils Silver Nanowire Products in South Korea
04/17/2025 | DuPontDuPont will showcase its state-of-the-art products that incorporate silver nanowire technologies in Hall D, Booth A31 at Electronics Manufacturing Korea (EMK) and Automotive World Korea (AWK) exhibitions from April 16 to 18.
Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions
04/16/2025 | BUSINESS WIRENortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.
QpiAI Announces Dawn of Quantum Era in India With 25 Qubit Quantum Computer
04/16/2025 | BUSINESS WIREQpiAI, a leader in quantum computing and generative AI, announced its First Quantum computer launch code named QpiAI Indus Quantum Computer.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
04/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.