Hyundai Mobis, Autotalks Collaborate to Implement Cutting-edge V2X Technology for Connected Cars
August 28, 2023 | PRNewswireEstimated reading time: 1 minute

Hyundai Mobis, a leading global automotive supplier and Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions are set to unveil their latest joint effort: Hyundai Mobis' MTCU (Multi-functional Telematics Control Unit) connectivity modules.
MTCU Gen1, Hyundai Mobis' most advanced connectivity module to date, supports Day-1 V2X services in all geographies. Powered by Autotalks' V2X chipset, the MTCU Gen1 sets the standard for high-performance, globally compatible automotive V2X. Day-1 applications alert drivers in dangerous, non-line-of-sight situations, for example to avert a possible collision with a vehicle or bicycle at an intersection. Additional applications include alerts about road hazards.
As the demand for V2X continues to grow, primarily driven by the global NCAP roadmap, Hyundai Mobis selected Autotalks' 3rd generation chipset to power its next-generation connectivity module solution, MTCU Gen2. The module, expected to be available in 2024, will enable car manufacturers to offer advanced safety applications based on V2X communication.
MTCU Gen2 enables a range of use-cases from basic Day-1 to advanced Day-2 V2X applications. This is achieved through its inherent support for the latest global V2X standards, dual-channel operation, and the integration of Functional Safety-grade implementation, enabling car actuation based on V2X data.
The MTCU Gen1 module will be showcased at the upcoming IAA Mobility exhibition, which will take place in Munich, Germany, between September 5th and September 10th, 2023. Hyundai Mobis will display its latest technical advancements and provide visitors with a glimpse into the future of connected-car user experiences at booth # B2 Hall D20.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
Micro LED Expands Beyond Displays, Unlocking New Opportunities in Transparent and Non-Display Applications
05/30/2025 | TrendForceTrendForce forecasts that the chip market value for Micro LED display applications will reach US$740 million by 2029, with a CAGR of 93% from 2024 to 2029.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
05/29/2025 | Amphenol Printed CircuitsAmphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.