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Indium Corporation’s Jason Chou to Present at SEMICON Taiwan
August 29, 2023 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.
In his presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, Chou will provide an overview of the die-attach process and explore the ongoing evolution of materials used in the application including high-Pb, low-alpha solder paste, high-temperature, Pb-free paste, and sintering products.
As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
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Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/13/2024 | Marcy LaRont, PCB007 MagazineAt the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.