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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Panasonic to Invest ¥92B in AI-related Business Expansion

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Foxconn Industrializes Intelligence and Scales the Future With AI Factories

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Murata to Expand Production Capacity of Multilayer Ceramic Capacitors Going Forward

10/30/2026 | Murata
Murata Manufacturing Co., Ltd. (Murata) will expand its global production capacity of multilayer ceramic capacitors (MLCCs) by 2030 to meet medium- to long-term demand growth.

Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.

Technica USA to Attend SEMICON West 2027, Expanding Presence in the Semiconductor Market

10/26/2026 | Technica USA
Technica USA recently attended the SEMICON West Expo, where company representatives Jason Perry, President; Peter Chen, Equipment Service Manager; and Frank Medina focused on strengthening relationships with customers and supply partners while preparing for the company’s participation in SEMICON West 2027 that will take place March 30-April 1, in Phoenix, Arizona.
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