Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

GPV Exhibits at Electronica 2026: Made for Moving Markets

09/25/2026 | GPV
From 10 to 13 November 2026, GPV will participate at Electronica in Munich, Germany. Visit us in Hall A1, Stand no. 115.

Technica & ASMPT Hosts Customers for SIPLACE CA2 Demo Week

09/25/2026 | Technica USA
Technica USA, together with the ASMPT team, recently hosted CM and OEM customers for private demonstrations of the SIPLACE CA2 at Technica’s Demo & Applications Center in San Jose

SMART Photonics, GlobalFoundries Partner on Open-Access Silicon-Photonics Foundry Service

09/24/2026 | GlobalFoundries
SMART Photonics B.V. announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART Photonics’ high-volume indium phosphide photonic integrated circuits (PICs), including lasers and modulators.

Merlin Flex Continues to Invest in Long Flex

09/24/2026 | Merlin Flex Ltd
Merlin Flex Ltd has continued its investment into the manufacture of its long flex capability with a new oil-heated vacuum lamination press with a bonding area of 1800mm by 750mm.

Lyntris Qualifies SPY-6 Radar Assembly for Naval Supply Chain

09/24/2026 | PRNewswire
Lyntris Inc., a defense technology company delivering sense-to-act connectivity solutions for the modern, connected battlespace, announced that it has completed qualification of a critical hardware assembly supporting Raytheon's SPY-6 family of radars.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in