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Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Chihuahua Expo & Tech Forum
August 30, 2023 | Conecsus Metals MexicoEstimated reading time: Less than a minute

Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Chihuahua Expo & Tech Forum on Thursday, September 7, 2023, beginning at 11:00 AM, at the Sheraton Chihuahua Soberano, BARRANCA DEL COBRE 3211, Chihuahua, Chihuahua, México.
Conecsus Metals México will showcase a variety of metals waste recycling solutions. With solder waste reprocessing facilities located in Terrell, TX, USA, Conecsus LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as complex by-products that can be recovered from industries in North America as well as World Wide.
Conecsus representatives Yessica Romero, Regional Sales Manager, and Carolina Renteria, Customer Services Manager, will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, and Silver, and converts them into usable metal products, paying its customers back for their metals waste. Conecsus is an ISO 14001 EMS-certified recycling company and a refiner of SMT solder/solder paste wastes and residues. The show offers free technical sessions, free lunch, and the opportunity to network with leading industry suppliers.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
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‘Create your Connections’ – Rehm at productronica 2025 in Munich
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10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.