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Zollner Strengthens Americas Strategy with Costa Rica Expansion

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VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

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Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

3 Key Takeaways From a New White Paper on Component Salvage

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Target Condition: Life in the Engineering Ecosystem

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A while back, I started thinking about the word ecosystem, a term that's become almost mandatory in discussions about electronics: the PCB ecosystem, the electronics ecosystem, and the design ecosystem. Is it more than an overused metaphor, or what if it really is an ecosystem? That question sent me down the kind of rabbit hole I enjoy. I started imagining electrical engineers, product managers, PCB designers, manufacturing and test engineers, supplier management, quality, and everyone else we work with fitting into the same kind of biological classification system we learned in high school.

Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

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