Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 1, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It must be almost fall; my air conditioning hasn’t switched on all day. I love living in Atlanta, but August was so hot that I thought I was going to melt.
As we head into the Labor Day weekend, we have a variety of articles for this week’s editor’s picks. Hannah Nelson discusses the onboarding process she went through when she started a new job. Gaurab Majumdar explains why tech companies should consider hiring workers from India. Happy Holden details the importance of great sensor technology and why sensors are a critical ingredient in Smart manufacturing processes. Mike Brask discusses the new IPS ENIG line installed at the SEL facility in Idaho, and Chris DeMartino explains how Modelithics works to provide simulation models, primarily for the RF/microwave community.
See you next time.
The New Chapter: Smoothing the Rocky Road of Onboarding
Published August 31
If you’ve ever moved to a new city to start a new job, Hannah Nelson’s newest column will ring true. She discusses what it was like to move from Indiana to Arizona for a job, how her new company welcomed her in and helped her onboard successfully, and what lessons she learned from the whole experience.
An Industry-ready Workforce in India
Published August 28
For about a decade, I’ve been reading news articles about India being at a crossroads. But according to IPC India Executive Director Gaurab Majumdar, the country may now be heading out on the highway with the accelerator floored. In this article, Gaurab explains why companies seeking technical staff should consider India, which has a large population of skilled technologists and college students ready to join the workforce.
It All Starts With Sensors
Published August 30
In this article, Happy Holden points out that manufacturing data collection begins with sensors. But the implementation of Smart processes requires much more than just great sensor technology, and you may have to upskill your staff or hire experts to take you to the finish line. As Happy says, “Time does not favor the procrastinator.”
Innovations in Final Finishing
Published August 31
One centerpiece of the new SEL facility in Idaho is the fully automated IPS ENIG line, which measures 81 feet in length. In this interview, IPS President Mike Brask explains how this line was custom-built for SEL to include a variety of features not usually seen in North America.
Model Citizens: Modelithics
Published August 28
We recently spoke with Chris DeMartino, an applications engineer at Modelithics, about the company’s business “model” of providing simulation models for the RF and microwave industries. Creating models is a tedious job for PCB designers and design engineers, so this could wind up being a real time-saver.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.