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Anda Technologies to Showcase State-of-the-Art Plasma, Dispensing and Coating Systems at SMTA International
September 6, 2023 | Anda Technologies USA, Inc.Estimated reading time: 1 minute
Anda Technologies, a leading provider of fluid application and custom automated manufacturing equipment, will exhibit in Booth #916 at the upcoming SMTA International exhibition. The event will be held at the Minneapolis Convention Center in Minnesota from Oct. 10-11, 2023.
Anda Technologies will utilize this prominent platform to showcase its cutting-edge SMT solutions designed to enhance productivity, precision, and flexibility in the electronics manufacturing industry. The company will also highlight its total selective coating and fluid dispensing line solutions along with the AP-3 Series inline surface plasma treatment machine, iJet-7 dispensing system, iCoat-5 conformal coating system and UV-2 curing oven.
The AP-3 Series by Anda, are advanced inline surface atmospheric pressure plasma treatment machines that are equipped with servo motors and a high-speed ball screw linear actuator system for accuracy. As standard, the AP-3P machine is equipped with a single plasma nozzle situated above the substrate to treat, clean away containments, and activate surfaces by increasing the surface’s energy. Surface energy is a key factor for how well a coating or adhesive will bond to a surface. Also available as an optional model, the AP-3DP utilizes dual plasma nozzles top and bottom (single nozzle above and single nozzle below substrate) two nozzles working simultaneously while performing their own independent plasma treatment motion path or program.
Anda’s iJet7H and iJet-7L fluid dispensing systems offer both precision and flexibility with a combination of electronic dispensing head and control software. The Anda user interface software ensures fast dispensing speeds and short cycle times. The machine is capable of dispensing adhesives and sealants.
The iCoat-5 Series Multi-Valve High Precision Selective Conformal Coating Machine is a highly flexible automated system that is suitable for panelized or palletized PCBAs, high mix requirements, process flexibility and large area coating. Suitable for dual or triple valve setup and a variety of different valve configurations, the iCoat-5 adapts to the production needs of diverse PCBAs.
The Anda UV curing oven series is the most powerful compact inline high intensity Ultraviolet (UV) curing oven system in the industry. It can exceed the maximum UV intensity requirements for curing virtually any UV curable product on the market today. In a class of its own, the system cost is also more affordable than rivaling products offered by competitors.
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Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
11/17/2025 | Sydney Xiao, Global Electronics Association East AsiaDiscussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.
SPEA Honored with Bosch Global Supplier Award
11/14/2025 | SPEABosch, a leading global supplier of technology and services, has honored SPEA with a prestigious Bosch Global Supplier Award, recognizing the company’s excellence as a provider of manufacturing test equipment and systems for microelectronics
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Sypris Reports Third Quarter Results
11/12/2025 | BUSINESS WIREThe Company’s third quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.