It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
Heraeus Electronics to Present Pastes for the Next Era of Mobility at SMTA International 2023
September 7, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Redefining Reliability and Cost Efficiency
Heraeus Electronics is revolutionizing the automotive industry with its Microbond® SMT660 Innolot® 2.0 solder alloy. This advanced solution offers an innovative approach to highly reliable and cost-effective solder alloys for automotive applications. By introducing the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while meeting emerging requirements, Heraeus Electronics is setting new industry benchmarks. The next generation of Innolot® alloy enhances creep resistance, leading to extended product life cycles at higher operating temperatures. Notably, the Microbond® SMT660 Innolot® 2.0 solder paste excels in reflow without the need for additional N2, keeping defect rates low and reducing TCO.
Advancements in Flux Design for Enhanced Performance
The Microbond® SMT660 solder paste incorporates a flux designed to deliver superior performance. An acrylic-based synthetic resin eliminates potential batch-to-batch variations often associated with natural raw materials. This approach, combined with low impurities, results in a high Surface Insulation Resistance (SIR) performance, reducing the risk of electrochemical migration. This flux combined with Innolot® or Innolot® 2.0 alloy synergy offers exceptional reliability, making it especially valuable in miniaturized systems within the automotive industry.
Focus on Sinter Paste Innovations
During the event, Heraeus Electronics also will showcase its cutting-edge sinter paste innovations. The PE401 Copper Pressure Sinter Paste represents a breakthrough material for die attach applications of high-power packages. Known for forming highly reliable joints with excellent thermal conductivity, PE401 is both lead-free and devoid of halogens and nano particles.
The mAgic Pressure Sinter Paste PE338 and PE338 F1510 Sinter Pastes for stencil and screen printing improve device reliability and provide high electrical conductivity, improving device efficiency. The pastes have proven to enhance workability on copper surfaces and elevate performance longevity by integrating wide band gap materials such as SiC and GaN.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.