Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
BTU will Showcase Innovative Aqua Scrub Flux Management Technology at SMTA International
September 7, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at SMTA International 2023. The event is scheduled to take place October 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. BTU to showcase its groundbreaking Aqua Scrub™ flux management technology, for its Pyramax™ and Aurora™ reflow ovens in Booth #1221.
“The Aqua Scrub flux management system has been a game changer for many of our high-volume reflow customers,” said Isaiah Smith, regional sales manager for BTU International. “The latest generation of Aqua Scrub is even more effective, with the use of our proprietary AQSB-300 solution – making the payback period even shorter than before,” added Smith.
Designed for seamless integration with the Pyramax and Aurora reflow ovens, the Aqua Scrub sets new standards in solder reflow flux management. The stand-alone unit is ingeniously engineered to retrofit onto existing BTU reflow ovens or be incorporated into new units, ensuring a smooth transition without compromising oven operation or factory floor space.
Aqua Scrub introduces a new era of operational efficiency, significantly reducing costs by up to 4X compared to conventional condensation systems. The patent-pending design harnesses aqueous-based scrubber technology compatible with a wide spectrum of paste and flux varieties. This innovative approach not only drives cost savings but also enhances environmental sustainability.
BTU International invites attendees to discover the future of reflow oven flux management technology at their booth during SMTA International. Discover how Aqua Scrub's pioneering approach is revolutionizing solder reflow processes, enhancing efficiency, and delivering unmatched value to the industry.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.