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BTU will Showcase Innovative Aqua Scrub Flux Management Technology at SMTA International
September 7, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at SMTA International 2023. The event is scheduled to take place October 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. BTU to showcase its groundbreaking Aqua Scrub™ flux management technology, for its Pyramax™ and Aurora™ reflow ovens in Booth #1221.
“The Aqua Scrub flux management system has been a game changer for many of our high-volume reflow customers,” said Isaiah Smith, regional sales manager for BTU International. “The latest generation of Aqua Scrub is even more effective, with the use of our proprietary AQSB-300 solution – making the payback period even shorter than before,” added Smith.
Designed for seamless integration with the Pyramax and Aurora reflow ovens, the Aqua Scrub sets new standards in solder reflow flux management. The stand-alone unit is ingeniously engineered to retrofit onto existing BTU reflow ovens or be incorporated into new units, ensuring a smooth transition without compromising oven operation or factory floor space.
Aqua Scrub introduces a new era of operational efficiency, significantly reducing costs by up to 4X compared to conventional condensation systems. The patent-pending design harnesses aqueous-based scrubber technology compatible with a wide spectrum of paste and flux varieties. This innovative approach not only drives cost savings but also enhances environmental sustainability.
BTU International invites attendees to discover the future of reflow oven flux management technology at their booth during SMTA International. Discover how Aqua Scrub's pioneering approach is revolutionizing solder reflow processes, enhancing efficiency, and delivering unmatched value to the industry.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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