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ZESTRON to Showcase Innovative Cleaning Solutions and Process Support at SMTA International 2023
September 11, 2023 | ZESTRONEstimated reading time: Less than a minute

ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce its participation in the upcoming Surface Mount Technology Association (SMTA) International Conference and Exhibition, scheduled to take place from October 9-12, 2023. The event, held at the Minneapolis Convention Center in Minneapolis, Minnesota, will provide an ideal platform for ZESTRON to showcase its cutting-edge cleaning technologies to a diverse audience of industry professionals.
Attendees visiting ZESTRON's booth can learn about the company's comprehensive range of cleaning solutions and analytical services that cater to various stages of the electronics manufacturing process. Whether implementing a new cleaning process, optimizing an existing one, or adhering to new regulations, ZESTRON partners with their customers to provide long-term reliability for critical applications.
ZESTRON's commitment to sustainability will also be a highlight at the exhibition. ZESTRON places a strong emphasis on developing environmentally friendly cleaning solutions that not only optimize performance but also adhere to the highest standards of eco-friendliness.
Visit ZESTRON at booth #1401 during SMTA International to learn more about their advanced cleaning solutions and engage with their expert team.
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07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
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Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.