Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

PCB Technologies Secures Approximately EUR 8.6M Orders from Semiconductor Client

06/19/2026 | PRNewswire
PCB Technologies, a global leader in advanced electronic and PCB manufacturing solutions, is pleased to report that during the past two weeks, until June 12, 2026, several orders have been placed with the company's PCB and Substrates Division by a leading customer in the European semiconductor equipment industry.

Fujitsu, IBM Japan Partner to Accelerate Enterprise System Modernization

06/19/2026 | JCN Newswire
Fujitsu Limited and IBM Japan, Ltd. announced that they will accelerate their collaboration in the field of business system modernization in order to advance enterprise digital transformation and address challenges associated with legacy systems.

Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.

SIA Applauds CHIPS Act Incentives for Coherent

06/18/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding manufacturing incentives announced by the Commerce Department and Coherent to support the expansion of Coherent’s indium phosphide manufacturing facility in Sherman, Texas.

MicroLED Interconnect Market to Reach $722M by 2033

06/16/2026 | PRNewswire
The global MicroLED interconnect market is entering a period of accelerated growth as artificial intelligence (AI), high-performance computing (HPC), and next-generation data center architectures drive demand for faster, more energy-efficient communication technologies.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in