Embark on an Innovative Journey: Mexico Technology Day 2023 by ViTrox & SMTo
September 12, 2023 | ViTroxEstimated reading time: 2 minutes

ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce that we will be partnering with our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV, to bring to you our Mexico Technology Day 2023. The event will occur on 6th October 2023, from 9.30 AM to 7.30 PM, at APODACA 1 ballroom, Crowne Plaza Aeropuerto Hotel, Monterrey, Mexico.
Our Mexico Technology Day 2023 is the premier event for original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) providers who are looking to stay ahead of the curve in today's fast-paced business landscape. This event will serve as a platform for us to engage with interested individuals who would like to learn more about ViTrox’s latest SMT PCBA inspection solutions., ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE. We will have designated stations that will feature each solution. We also aim to share with you all how you can achieve production efficiency and excellence with our latest artificial intelligence (A.I.) technologies.
To kickstart the event, we will be hosting an open-day session, from 9.30 AM to 2.30 PM, where you can receive a FREE AOI test report using your own sample boards! From this open-day session, you can experience the efficiency and effectiveness of our V510i Advanced 3D Optical Inspection (AOI) Solution’s A.I. technologies, which are our A.I. Smart Programming and also under how AI can assist operators on the defect review through A.I. Assisted Defect Review (A.I. VVTS). However, slots for this event are limited, so do reserve your slots today by reaching out to our team: ViTrox Mexico Business Development Director, Mr Carlos Ponce, or SMTo’s ViTrox Account Manager, Mr Juan Carlos Santoyo.
We will also be conducting informative sharing sessions on how ViTrox’s A.I. technologies and Smart Industry 4.0 solutions assist your production for better efficiency and also support engineers and operators for a better work-life with all the interesting features from our platform, as well as our value proposition that is guaranteed to give you an advantage in the OEM and EMS industry! Among the benefits you will reap from our solutions are:
- V310i 3D SPI: Machine-to-machine (M2M) communication with printers, and high-speed inspection programming setup with Ultra Smart A.I. Programming
- V510i 3D AOI: A wide coverage of up to 90% SMT component coverage with A.I. Smart Programming, and up to 60% labour reduction with A.I. VVTS.
- V810i 3D AXI: Effortless programming and process optimisation with AXI A.I. Solutions (A.I. Programming, A.I. Classification and A.I. VVTS) for challenging joint inspections (IGBT, HiP, etc.)
- V9i ARV: Reliable, consistent and traceable inspection with 2-in-1 inspection capabilities (covering conformal coating and final assembly inspections).
- V-ONE: Monitor production status and experience real-time data traceability, process optimisation and quality assurance.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.