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Embark on an Innovative Journey: Mexico Technology Day 2023 by ViTrox & SMTo
September 12, 2023 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce that we will be partnering with our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV, to bring to you our Mexico Technology Day 2023. The event will occur on 6th October 2023, from 9.30 AM to 7.30 PM, at APODACA 1 ballroom, Crowne Plaza Aeropuerto Hotel, Monterrey, Mexico.
Our Mexico Technology Day 2023 is the premier event for original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) providers who are looking to stay ahead of the curve in today's fast-paced business landscape. This event will serve as a platform for us to engage with interested individuals who would like to learn more about ViTrox’s latest SMT PCBA inspection solutions., ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE. We will have designated stations that will feature each solution. We also aim to share with you all how you can achieve production efficiency and excellence with our latest artificial intelligence (A.I.) technologies.
To kickstart the event, we will be hosting an open-day session, from 9.30 AM to 2.30 PM, where you can receive a FREE AOI test report using your own sample boards! From this open-day session, you can experience the efficiency and effectiveness of our V510i Advanced 3D Optical Inspection (AOI) Solution’s A.I. technologies, which are our A.I. Smart Programming and also under how AI can assist operators on the defect review through A.I. Assisted Defect Review (A.I. VVTS). However, slots for this event are limited, so do reserve your slots today by reaching out to our team: ViTrox Mexico Business Development Director, Mr Carlos Ponce, or SMTo’s ViTrox Account Manager, Mr Juan Carlos Santoyo.
We will also be conducting informative sharing sessions on how ViTrox’s A.I. technologies and Smart Industry 4.0 solutions assist your production for better efficiency and also support engineers and operators for a better work-life with all the interesting features from our platform, as well as our value proposition that is guaranteed to give you an advantage in the OEM and EMS industry! Among the benefits you will reap from our solutions are:
- V310i 3D SPI: Machine-to-machine (M2M) communication with printers, and high-speed inspection programming setup with Ultra Smart A.I. Programming
- V510i 3D AOI: A wide coverage of up to 90% SMT component coverage with A.I. Smart Programming, and up to 60% labour reduction with A.I. VVTS.
- V810i 3D AXI: Effortless programming and process optimisation with AXI A.I. Solutions (A.I. Programming, A.I. Classification and A.I. VVTS) for challenging joint inspections (IGBT, HiP, etc.)
- V9i ARV: Reliable, consistent and traceable inspection with 2-in-1 inspection capabilities (covering conformal coating and final assembly inspections).
- V-ONE: Monitor production status and experience real-time data traceability, process optimisation and quality assurance.
Suggested Items
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
09/09/2024 | Indium CorporationIndium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
Eutect Overcomes Panel Soldering Challenges with New Gripper
09/06/2024 | Eutect GmbHThe selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.