-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Embark on an Innovative Journey: Mexico Technology Day 2023 by ViTrox & SMTo
September 12, 2023 | ViTroxEstimated reading time: 2 minutes

ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce that we will be partnering with our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV, to bring to you our Mexico Technology Day 2023. The event will occur on 6th October 2023, from 9.30 AM to 7.30 PM, at APODACA 1 ballroom, Crowne Plaza Aeropuerto Hotel, Monterrey, Mexico.
Our Mexico Technology Day 2023 is the premier event for original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) providers who are looking to stay ahead of the curve in today's fast-paced business landscape. This event will serve as a platform for us to engage with interested individuals who would like to learn more about ViTrox’s latest SMT PCBA inspection solutions., ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE. We will have designated stations that will feature each solution. We also aim to share with you all how you can achieve production efficiency and excellence with our latest artificial intelligence (A.I.) technologies.
To kickstart the event, we will be hosting an open-day session, from 9.30 AM to 2.30 PM, where you can receive a FREE AOI test report using your own sample boards! From this open-day session, you can experience the efficiency and effectiveness of our V510i Advanced 3D Optical Inspection (AOI) Solution’s A.I. technologies, which are our A.I. Smart Programming and also under how AI can assist operators on the defect review through A.I. Assisted Defect Review (A.I. VVTS). However, slots for this event are limited, so do reserve your slots today by reaching out to our team: ViTrox Mexico Business Development Director, Mr Carlos Ponce, or SMTo’s ViTrox Account Manager, Mr Juan Carlos Santoyo.
We will also be conducting informative sharing sessions on how ViTrox’s A.I. technologies and Smart Industry 4.0 solutions assist your production for better efficiency and also support engineers and operators for a better work-life with all the interesting features from our platform, as well as our value proposition that is guaranteed to give you an advantage in the OEM and EMS industry! Among the benefits you will reap from our solutions are:
- V310i 3D SPI: Machine-to-machine (M2M) communication with printers, and high-speed inspection programming setup with Ultra Smart A.I. Programming
- V510i 3D AOI: A wide coverage of up to 90% SMT component coverage with A.I. Smart Programming, and up to 60% labour reduction with A.I. VVTS.
- V810i 3D AXI: Effortless programming and process optimisation with AXI A.I. Solutions (A.I. Programming, A.I. Classification and A.I. VVTS) for challenging joint inspections (IGBT, HiP, etc.)
- V9i ARV: Reliable, consistent and traceable inspection with 2-in-1 inspection capabilities (covering conformal coating and final assembly inspections).
- V-ONE: Monitor production status and experience real-time data traceability, process optimisation and quality assurance.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.