-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTechnical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
September 15, 2023 | TRIEstimated reading time: 1 minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
Suggested Items
Bridging the Gap: Workforce Collaboration in East Texas
02/13/2025 | Cory Blaylock, IPCIPC has partnered with Stephen F. Austin State University's (SFASU) Center for Applied Research and Rural Innovation (CARRI) and the IPC Education Foundation on a transformative project aimed at aligning academic training with real-world demands in electronics manufacturing.
IPC Hall of Fame Spotlight Series: Highlighting Doug Pauls
02/12/2025 | Dan Feinberg, Technology Editor, I-Connect007Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.
Pieces of a Puzzle: PCB Designer John Watson Sees the Big Picture of Life and Work
02/13/2025 | Michelle Te, IPC CommunityJohn Watson started his career in military intelligence and as an electronics repair technician but moved over to printed circuit board design at a time when the whole electronics industry was experiencing a paradigm shift.
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
02/11/2025 | Chris Mitchell -- Column: The Government CircuitAs the calendar turns to mid-February, IPC’s government relations and advocacy work is in full swing around the world. Here are four things to know, big picture, about how we’re approaching the current, very complicated situation.
Empowering Interns: Shaping Tomorrow's Tech
02/10/2025 | Marcy LaRont, PCB007 MagazineToday, we widely accept that creating and leveraging opportunities to fill our future tech workforce is paramount to future success—both as individual companies and as an industry. This is even more true, and certainly more challenging, for in-person manufacturing jobs. In our conversation, Gerry Partida of Summit Interconnect focuses on the essential role of interns in the technological landscape and emphasizes how nurturing their skills and potential contributes significantly to the future of technology and business operations in our companies today.