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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 15, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
It’s been a hot week in Atlanta. The Braves just clinched the division title with the best record in the league, 95-50, and Matt Olson tied the Braves’ franchise record with 51 home runs in one season (more than Hank Aaron ever hit in one year, if you’re a baseball history buff).
We’ve had a hot week in this industry too. In my picks for this week, we introduce a new SMT007 columnist, and we have a look at the CHIPS Act one year later. We have a great article about sourcing diversification, and a look at the latest electronics news coming out of India. And columnist Vern Solberg explains DFM best practices for flexible circuits.
Have a great weekend!
Meet Aidan Salvi of Amitron, SMT007 Columnist
Published September 14
This week, we welcomed Aidan Salvi to the I-Connect007 columnist roster. Aidan is the chief transformation officer for Amitron, and he’ll be covering the move from robots to cobots in PCB manufacturing. Check out his columns in the SMT007 and Mil-Aero newsletters.
Sourcing Diversification – Empowering Your Supply Chain for Success
Published September 13
The supply chain situation has stabilized now, but smart companies are being proactive and shoring up their sourcing processes, just in case. Léa Maurel of ICAPE has a great article about sourcing diversification and the need to foster relationships with multiple vendors from around the globe.
CHIPS Act, One Year On
Published September 12
It’s been one year since the CHIPS Act was introduced with a lot of hoopla and promises to fund the U.S. electronics industry. But where are we now? Has anything really changed? In this conversation, PCBAA Chair Travis Kelly lays it all out. He also discusses the Protecting Circuit Boards and Substrates Act that was recently reintroduced in Congress.
Designer’s Notebook: DFM Principles for Flexible Circuits
Published September 14
DFM practices can be challenging in the best of times, and things only get crazier when we move into flexible circuits. In this column, Vern Solberg discusses flex DFM techniques that designers need to keep in mind when working in the 3D flex environment.
Material Insight: India’s Rise in the Global Electronics Ecosystem
Published September 12
In this column, Preeya Kuray focuses on India’s continued expansion in the global electronics market. She discusses some of the electronics news from the Land of Many Wonders, including Micron’s plans to build a $2.75 billion advanced packaging factory in India. There’s a lot going on in India right now.
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Rachael Temple - AlltematedSuggested Items
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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