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Completion of New R&D Building at Sabae Murata Manufacturing
September 18, 2023 | MurataEstimated reading time: Less than a minute

Sabae Murata Manufacturing Co., Ltd. (in Sabae, Fukui Prefecture), a manufacturing subsidiary of Murata Manufacturing Co., Ltd., has completed a new research and development building that had been under construction on its premises since February 2022, and a ceremony to celebrate its completion was held on September 13 (Wed).
The new research and development building will be used for developing plating technology suitable for making electronic components smaller, thinner, and lighter, as well as the necessary technology to bring it to mass production.
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GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
09/26/2023 | GlobalFoundriesGlobalFoundries (GF) announced it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
09/22/2023 | GlobalFoundriesThe U.S. Department of Defense (DoD) has awarded GlobalFoundries (Nasdaq: GFS) (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
APCT Appoints Peter Austin as President and CEO, Effective September 1
09/25/2023 | APCTAPCT, a leading name in the PCB and electronics industry, is delighted to announce the appointment of Peter Austin as its President and CEO, effective September 1. Peter takes the reins from former CEO, Steve Robinson, who has retired after years of dedicated service to the company.
What is Ultra HDI?
09/22/2023 | Happy Holden, I-Connect007Ever since high density interconnect (HDI) was created in 1982 by Hewlett-Packard to package its first 32-bit computer powered by a single chip, it has continued to evolve and provide the solutions for miniaturized products. The leading edge of HDI technology became the process used for organic flip-chip packaging for the semiconductor industry. The two distinct markets—IC substrates and product-system integration—are now colliding and utilizing the same ultra-HDI manufacturing processes.
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes
09/21/2023 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum.