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StratEdge Reveals High-Performance Semiconductor Packages at European Microwave Week, IMAPS International, and IEEE BCICTS
September 19, 2023 | StratEdgeEstimated reading time: Less than a minute
StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including European Microwave Week (EuMW), September 19-21, IMAPS International, October 3-4, and IEEE BCICTS, October 16-17. StratEdge packages dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) and operate from DC to 63+ GHz. The packages provide ultra-low loss performance over a wide range of frequencies, depending on the style and mounting configuration. Many open-tooled designs are available with 50 ohm impedance, which provide convenience and ease for packaging your high-performance semiconductors.
Casey Krawiec, VP of Global Sales at StratEdge, emphasized, "We manufacture our packages with precision, using post-fired ceramics with laser-cut features to control tight tolerances, thermally-enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. For further optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, equipped with the latest precision wire bonding and die attach systems."
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StratEdge Brings Gold Medal Performance with its Molded Ceramic and Post-fired Ceramic Packages, and High-reliability Assembly Services
08/14/2024 | StratEdgeStratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading high-reliability assembly services.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
SMTA Oregon Event Spreads Its Wings
06/25/2024 | Nolan Johnson, I-Connect007Hillsboro, Oregon is home to the largest Intel campus in the United States as the base of operations for most of Intel’s CPU development. Hillsboro boasts experts and teams in IC and PCB physical layout, packaging, and R&D. Intel and satellite companies in its orbit deliver PCB fabrication and PCB assembly as well. So it's no surprise that SMTA Oregon’s annual meeting takes place practically in the shadows of Intel’s Hillsboro campus.
TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls
06/17/2024 | TopLineWürth Elektronik Expands its Range of Power Inductors
05/29/2024 | Wurth ElectronicsIn addition to Würth Elektronik’s five existing package sizes of WE-XHMI SMT power inductors there are now eight new packages. These compact yet extremely efficient inductors feature high current capacity up to 56 A saturation current and the ability to handle high transient current spikes.