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EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry

12/04/2023 | EMA Design Automation
EMA Design Automation, the world's premier EDA VAR, is spinning off their IP, content, and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions.

Cadence Signoff Solutions Empower Samsung Foundry’s Breakthrough Success on 5G Networking SoC Design

12/01/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced that Samsung Foundry successfully taped out a 5G networking SoC design on the Samsung 5LPE technology using the Cadence® Quantus™ Extraction Solution and Tempus™ Timing Solution.

Dana on Data: Simplify PCB Documentation

11/29/2023 | Dana Korf -- Column: Dana on Data
November’s issue of Design007 Magazine had an excellent theme that evolved around design simplification. There were exceptionally good articles about how to reduce over-constrained or needlessly complex designs. One significant time-consuming category is the creation of many design files and drawings which lead to lengthy creation and interpretation time along with the considerable time to resolve conflicting or erroneous information.

iNEMI Packaging Tech Topic Series Webinar: LSI/PKG/PCB Co-Design

11/21/2023 | iNEMI
iNEMI Packaging Tech Topic Series Webinar, LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design will be held on November 28, 2023, by guest speaker Kazunari Koga, Zuken Inc.

Next-Generation Microelectronics Manufacturing Opens Phases 1 and 2

11/21/2023 | DARPA
DARPA is seeking collaboration that will shape the Next-Generation Microelectronics Manufacturing (NGMM) program – an effort to help usher in a new era of microchips and their future applications.
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