Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
TRI's New Ultra-High-Speed 3D AOI at the SMTA Guadalajara 2023
September 19, 2023 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2023 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #917 at the SMTA Expo Guadalajara from October 25 to 26, 2023, to experience the latest test and inspection innovations for the Electronics Manufacturing Industry.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, able to inspect at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities.
Furthermore, TRI will showcase the award-winning series 3D SPI TR7007QI Plus, Multi-Angle 3D AOI solution TR7500QE, and an Automated 3D X-Ray Inspection solutions demo.
Discover why the leading EMS companies choose TRI as their Test and Inspection Partner. Visit us at SMTA Guadalajara 2023 booth #917 for a personal demonstration of TRI's industry-leading One Stop Solution for PCB Assembly Testing and Inspection.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.