Rigid-flex DFA
September 19, 2023 | Andy Shaughnessy, Design007Estimated reading time: 1 minute

Rigid-flex assembly brings its own set of issues, but designers can do quite a bit to make things easier on their downstream brethren. We asked IPC instructor Kris Moyer to give us the lowdown on DFA for rigid-flex circuitry.
Kris, what are some of the unique challenges related to assembling rigid-flex circuits?
There are several challenges to assembly of rigid-flex boards. First there is the alignment issue of the different sections of the boards. With a rigid board, the individual boards can be removed from the fabrication panel and run through the SMT assembly line without much problem, as long as the board is of sufficient size. In this case, the relative position of all the individual parts on the board remains consistent. But with rigid-flex, after the board is removed from the fabrication panel, the individual boards can move and rotate relative to each other within the limits of the flex material. This makes the placement of parts difficult to control. To overcome this, the board must be held in a restrained condition throughout the assembly process. This will require either the fabrication of a custom fixture to hold the board restrained during assembly or the design of temporary removable restraining mechanisms (rails) into the design of the board.
To read this entire conversation, which appeared in the September 2023 issue of Design007 Magazine, click here.
Suggested Items
Redwire Successfully Delivers Onboard Computer for ESA’s Comet Interceptor Mission to Study Pristine Comet
05/27/2025 | BUSINESS WIRERedwire Corporation, a leader in space infrastructure for the next generation space economy, announced that it has successfully delivered the onboard computer for the European Space Agency’s (ESA) Comet Interceptor mission.
Mycronic Executes Share Split and Determines Record Date
05/27/2025 | MycronicThe annual general meeting of Mycronic AB (publ) held on May 7, 2025, resolved to increase the number of shares by a share split, whereby one (1) existing share will be split into two (2) shares.
Beyond Design: Radiation and Interference Coupling
05/21/2025 | Barry Olney -- Column: Beyond DesignRadiation and interference coupling pose significant challenges to the performance and reliability of high-speed digital designs. Whether it's the unintended emission of electromagnetic waves or the interaction of signals between adjacent circuits, these phenomena can lead to unwanted noise, signal distortion, and even system malfunctions. Understanding the mechanisms behind radiation and interference coupling is crucial for electronics designers seeking to design robust and efficient systems.
Global PCB Market Forecast to Reach $86.5 Billion by 2029 with 5.9% Annual Growth
05/19/2025 | EINPresswire.comThe printed circuit board market size has witnessed steady growth in recent years and the trend is anticipated to continue. Increasing from $65.82 billion in 2024 to $68.75 billion in 2025, it showcases a compound annual growth rate CAGR of 4.5%.
SEMI North America Advisory Board Welcomes New Member From SACHEM
05/15/2025 | SEMISEMI announced the election of a new member to the SEMI North America Advisory Board (NAAB), Rosemary Steen Hoffman, Chief Executive Officer, SACHEM, Inc., a premier supplier of high-purity, precision-based chemistries.