Mycronic Executes Share Split and Determines Record Date
May 27, 2025 | MycronicEstimated reading time: 1 minute
The annual general meeting of Mycronic AB (publ) held on May 7, 2025, resolved to increase the number of shares by a share split, whereby one (1) existing share will be split into two (2) shares. The annual general meeting authorized the board of directors to determine the record date for the share split. The board of directors has now resolved, by virtue of the authorization granted by the annual general meeting, that the record date for the share split shall be June 4, 2025.
Last day of trading in Mycronic AB’s shares prior to the share split is June 2, 2025. First day of trading in Mycronic AB’s shares post the share split is June 3, 2025. As a consequence of the share split, Mycronic AB’s shares will be traded under a new ISIN code as of June 3, 2025. The new ISIN code for Mycronic AB’s shares is SE0025158629.
The share split will be automatically implemented via Euroclear Sweden AB and no actions are required by the shareholders. The new number of shares is expected to be registered on the securities account (Sw. VP-konto) of each shareholder by June 5, 2025.
After the share split the total number of shares in Mycronic AB will amount to 195,833,018.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/08/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Datest Marches Into SMTA International with Backup Plans, Big Partnerships, and Bigger X-rays
10/06/2025 | DatestDatest, the industry’s favorite second set of eyes (and hands, and solder joints), is heading to SMTA International 2025 at the Donald E. Stephens Convention Center in Rosemont, IL. Find us at Booth #2627, where high-reliability, high-complexity builds meet their match.
Imec’s New GeSi Modulator Hits 400Gb/s, Paving the Way for Next-Gen Optical Interconnects
10/02/2025 | ImecImec – a world-leading research and innovation hub in nanoelectronics and digital technologies – today announced the successful demonstration of a beyond-110GHz C-band GeSi electro-absorption modulator, fabricated on its 300mm silicon photonics platform.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.