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Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment

01/07/2025 | PRNewswire
SparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®

Amar Maletira Appointed to Celestica’s Board of Directors

01/07/2025 | Celestica
Celestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies is pleased to announce the appointment of Amar Maletira to its Board of Directors, effective January 1, 2025.

Zhen Ding’s Subsidiary BoardTek Electronics Experienced a Fire Incident

01/06/2025 | Zhen Ding Technology
Zhen Ding Technology Holding Co., Ltd. announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory (January 5th). BoardTek promptly evacuated all personnel without any injuries.Zhen Ding Technology Holding Co., Ltd. announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory.

TRI to Host Test and Inspection Technology Seminars

01/02/2025 | TRI
Test Research, Inc. (TRI) is proud to announce the 2025 Technology Seminars, which will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou.
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