Rigid-flex DFA
September 19, 2023 | Andy Shaughnessy, Design007Estimated reading time: 1 minute

Rigid-flex assembly brings its own set of issues, but designers can do quite a bit to make things easier on their downstream brethren. We asked IPC instructor Kris Moyer to give us the lowdown on DFA for rigid-flex circuitry.
Kris, what are some of the unique challenges related to assembling rigid-flex circuits?
There are several challenges to assembly of rigid-flex boards. First there is the alignment issue of the different sections of the boards. With a rigid board, the individual boards can be removed from the fabrication panel and run through the SMT assembly line without much problem, as long as the board is of sufficient size. In this case, the relative position of all the individual parts on the board remains consistent. But with rigid-flex, after the board is removed from the fabrication panel, the individual boards can move and rotate relative to each other within the limits of the flex material. This makes the placement of parts difficult to control. To overcome this, the board must be held in a restrained condition throughout the assembly process. This will require either the fabrication of a custom fixture to hold the board restrained during assembly or the design of temporary removable restraining mechanisms (rails) into the design of the board.
To read this entire conversation, which appeared in the September 2023 issue of Design007 Magazine, click here.
Suggested Items
CEE PCB Appoints Markus Voeltz to Business Development Director Europe
04/02/2025 | CEE PCBCEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and began providing local support in March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Sierra Circuits Inc. Chooses atg A9L Flying Probe Technology for High-speed Electrical Test
04/01/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator Sierra Circuits Inc. in Sunnyvale, CA.
Real Time with... IPC APEX EXPO 2025: Schmoll America—Committed to Supporting Customers
03/31/2025 | Real Time with...IPC APEX EXPOKurt Palmer of Schmoll America and Stephan Kunz of Schmoll Maschinen GmbH had a great show, reporting solid attendance and good opportunities, as Schmoll America celebrates its first anniversary. With a booth full of equipment for attendees to see and touch, they showcased unique products like the Pico laser and X-ray machine, and discussed plans for a new facility.
Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary
03/28/2025 | Zollner Elektronik AGIn a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.