Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Flex Names Planned Cloud and Power Spin-Off and Files Form 10 Registration Statement

09/18/2026 | Flex
The Form 10 provides additional information about Axiom, including its business, strategy, financial profile, leadership team and the anticipated terms of the separation.

Advanced Packaging and the New Scaling Walls

09/17/2026 | Chetan Arvind Patil, Marvell Technology
Advanced packaging is becoming the foundation for semiconductor scaling in the AI era. As monolithic processors encounter practical limits around reticle size, yield, memory bandwidth, power, and cost, the industry is moving toward architectures built from multiple compute dies, HBM stacks, I/O chiplets, and heterogeneous packaging solutions. The result is that semiconductor scaling is no longer determined only by how much functionality can be integrated into a single die, but by how much silicon can be integrated efficiently within a package.

Analog Devices to Acquire Alif Semiconductor

09/16/2026 | PRNewswire
Analog Devices, Inc. and Alif Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Alif in an all-cash transaction for $1.35 billion.

Data Center Power Demand to Rise 31% in 2026, Grid Gap to Widen in 2028

09/16/2026 | TrendForce
TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications.

Infineon, SolarEdge Extend 800 VDC AI Data Center Collaboration

09/15/2026 | Infineon
Infineon Technologies AG and SolarEdge Technologies, Inc., a global leader in smart energy, announced an extension of their collaboration to advance solid-state circuit breaker (SSCB) technology for high-voltage DC distribution in AI and hyperscale data centers.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in