Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers

05/27/2026 | I-Connect007 Editorial Team
Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.

Semiconductor Packaging Materials Market to Hit $93.7B by 2031, Driven by AI and Chiplet Demand

05/22/2026 | openPR
The global Semiconductor and IC Packaging Materials Market reached USD 43.1 billion in 2023 and is expected to reach USD 93.7 billion by 2031, growing at a CAGR of 10.2% during the forecast period of 2024-2031.

Amphenol Printed Circuits Shows PCBs of All Sizes at 2026 IEEE MTT-S

05/22/2026 | Amphenol Printed Circuits
Amphenol Printed Circuits (APC) will once again be bringing examples of their printed circuit board (PCB) design and manufacturing skills to the RF/microwave industry’s major annual technology event, 2026 IEEE MTT-S International Microwave Symposium (IMS), June 9–11, at the Thomas M. Menino Convention & Exhibition Center in Boston.

Asahi Kasei Develops Photosensitive Polyimide Film for Panel-Level Semiconductor Packaging

05/21/2026 | BUSINESS WIRE
Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response to these market changes, Asahi Kasei, a diversified global company, has combined the features of its photosensitive polyimide (PSPI) and dry film photoresist (DFR) into a new photosensitive film.

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in