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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Yamaha Extends Surface-mount Software Toolkit for Right-first-time Printing

03/10/2026 | Yamaha Robotics
Yamaha Robotics has revealed advanced setup assistance for surface-mount printers that boosts productivity by quickly optimizing printer settings and accelerating new product introduction (NPI).

Flex Opens New Product Introduction (NPI) Center Serving Healthcare Customers in North America

03/25/2025 | Flex
Flex announced the opening of its new product introduction (NPI) center near Boston, Mass., serving healthcare customers.

ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave

03/26/2024 | ITW EAE
ITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.

Inpixon, Ostendo Reimagine Hybrid Workplace with Wearable Augmented Reality Display Glasses

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Inpixon, the Indoor Intelligence company, announced it has executed a strategic alliance and co-marketing agreement with Ostendo Technologies, Inc., a leader in quantum photonics and micro-display technologies.

The Vital Role of Solder Paste Printing in New Product Introduction

02/22/2018 | Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.
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