CACI Successfully Completes Optical Communications Terminal Interoperability Testing for Space Development Agency’s Transport Layer
September 25, 2023 | CACI International Inc.Estimated reading time: 1 minute
CACI International Inc announced that it successfully completed Optical Communication Terminal (OCT) Interoperability Testing (OIT) of its CrossBeam® OCT for the Space Development Agency’s (SDA) Tranche 1 data relay and tracking network. As part of this testing, CACI was the first SDA-compliant terminal to successfully establish a consistent data communication link with the reference modem.
“Our proven, mature, and low-risk technology, combined with our advancements in scalable, U.S.-based manufacturing capacity, will rapidly transform sensing and communications for national security missions,” said Todd Probert, President of National Security and Innovative Solutions at CACI. “Our innovations in optical communications help the SDA build the foundation of future warfighting infrastructure and resilient networks across all domains.”
The testing was done with SDA as part of a team led by Lockheed Martin to build 42 satellites for SDA's Tranche 1 Transport Layer (T1TL), a mesh network of 126 optically interconnected space vehicles that will provide a resilient, low-latency, high-volume data transport communication system slated for launch in late 2024. The T1TL will provide global communications access and deliver persistent regional encrypted connectivity in support of warfighter missions around the globe, serving as the backbone for the Department of Defense’s Joint All Domain Command and Control (JADC2) effort.
This successful testing demonstrates performance to the version 3.0 standard and allows the CrossBeam OCT to move forward with OIT with optical payloads, thereby verifying interoperability in support of SDA’s Proliferated Warfighter Space Architecture constellation of tracking and transport satellites.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Meet with The Test Connection Inc. (TTCI) at SMTA Guadalajara 2025
08/18/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation at the upcoming SMTA Guadalajara Expo & Tech Forum, taking place September 17–18, 2025, at Expo Guadalajara, Salón Jalisco Hall D & E.
MoU to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
08/07/2025 | PRNewswireLightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.