Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
StenTech Discusses Revolution of Stencil Manufacturing with Laser Technology at SMTA Guadalajara
September 25, 2023 | StenTechEstimated reading time: 1 minute
StenTech Inc., the leading multinational SMT Printing Solutions company, is pleased to announce plans to exhibit at the SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico. This year's exhibition promises to be a game-changer as StenTech unveils its latest capabilities, including a state-of-the-art laser system and award-winning Advanced Nano Coating in Booth 920.
StenTech has raised the bar in the stencil manufacturing industry by making a substantial investment in the newest iteration of the StencilLaser G6080 from LPKF Laser & Electronics. This cutting-edge laser system represents a significant milestone for the SMT industry in Mexico, showcasing StenTech's unwavering commitment to its esteemed local customer base in Jalisco.
The StencilLaser G6080 stands as a flagship laser system, renowned for its best-in-class technology, tailored to meet the exacting demands of even the most discerning stencil users in the SMT industry. Distinguished by its custom carbon fiber architecture, this state-of-the-art laser system ensures superior positioning accuracy and sidewall quality while maximizing productivity. Versatile and adaptable, it is capable of cutting stainless steel and nickel stencils with material thicknesses ranging from 20 um to 1 mm (0.8 to 40 mil). StenTech's investment in this advanced laser technology empowers the company to deliver stencil solutions that consistently meet the highest industry standards.
In addition to its latest investment in state-of-the-art laser technology, StenTech's Guadalajara facility also offers an array of cutting-edge capabilities, including Advanced Nano Coating, tooling solutions, and unparalleled customer service. The combination of these advanced offerings positions StenTech as a trusted partner for the most demanding stencil projects, meeting the unique needs of its customers across various industries.
The Advanced Nano Coating features an exceptional 1-3 um hardened nano coating expertly applied to the bottom side and inside the apertures of the stencil. This cutting-edge technology offers remarkable anti-adhesion properties, effectively repelling solder flux and ensuring superior paste transfer.
By harnessing the power of StenTech's Advanced Nano Coating, transfer efficiency can soar by up to 25 percent, resulting in a substantial reduction in bridging and paste-related defects. The "non-stick" characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and decreased expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use just 30 minutes after coating, elevating production efficiency and minimizing downtime.
Share on:
Suggested Items
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
ViTrox Americas Expands Reach in Southern U.S. with MaRCTex
11/21/2024 | ViTroxViTrox Americas Inc. is pleased to announce the appointment of MaRCTex Inc. as its new representative for the states of Texas, Louisiana, Oklahoma and Arkansas. Led by industry veteran Mike Gunderson, MaRCTex has a proven track record of supplying essential tools and solutions for the electronics manufacturing and high-tech industry across the United States. Additionally, demos are available at the ViTrox Americas Demo Center in Hutto, Texas.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins
11/19/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.
RTX's Raytheon Awarded U.S. Army Contract for Wireless Power Beaming Technology
11/18/2024 | Raytheon TechnologiesRaytheon, an RTX, has been awarded a contract from the U.S. Army to work on directed energy wireless power beaming capabilities that will distribute power across the battlefield, simplify logistics, and safeguard locations for U.S. troops.