Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
StenTech Discusses Revolution of Stencil Manufacturing with Laser Technology at SMTA Guadalajara
September 25, 2023 | StenTechEstimated reading time: 1 minute
StenTech Inc., the leading multinational SMT Printing Solutions company, is pleased to announce plans to exhibit at the SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico. This year's exhibition promises to be a game-changer as StenTech unveils its latest capabilities, including a state-of-the-art laser system and award-winning Advanced Nano Coating in Booth 920.
StenTech has raised the bar in the stencil manufacturing industry by making a substantial investment in the newest iteration of the StencilLaser G6080 from LPKF Laser & Electronics. This cutting-edge laser system represents a significant milestone for the SMT industry in Mexico, showcasing StenTech's unwavering commitment to its esteemed local customer base in Jalisco.
The StencilLaser G6080 stands as a flagship laser system, renowned for its best-in-class technology, tailored to meet the exacting demands of even the most discerning stencil users in the SMT industry. Distinguished by its custom carbon fiber architecture, this state-of-the-art laser system ensures superior positioning accuracy and sidewall quality while maximizing productivity. Versatile and adaptable, it is capable of cutting stainless steel and nickel stencils with material thicknesses ranging from 20 um to 1 mm (0.8 to 40 mil). StenTech's investment in this advanced laser technology empowers the company to deliver stencil solutions that consistently meet the highest industry standards.
In addition to its latest investment in state-of-the-art laser technology, StenTech's Guadalajara facility also offers an array of cutting-edge capabilities, including Advanced Nano Coating, tooling solutions, and unparalleled customer service. The combination of these advanced offerings positions StenTech as a trusted partner for the most demanding stencil projects, meeting the unique needs of its customers across various industries.
The Advanced Nano Coating features an exceptional 1-3 um hardened nano coating expertly applied to the bottom side and inside the apertures of the stencil. This cutting-edge technology offers remarkable anti-adhesion properties, effectively repelling solder flux and ensuring superior paste transfer.
By harnessing the power of StenTech's Advanced Nano Coating, transfer efficiency can soar by up to 25 percent, resulting in a substantial reduction in bridging and paste-related defects. The "non-stick" characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and decreased expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use just 30 minutes after coating, elevating production efficiency and minimizing downtime.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Gardien Services Installs Customized G93 Flying Probe Tester – Largest Test Area in North America/Europe
08/24/2025 | Gardien GroupGardien Group is proud to announce the successful installation of a customized G93 Flying Probe Test Machine at a major manufacturer in North America. This cutting-edge system features the largest test area of any flying probe tester in North America and Europe, setting a new benchmark for PCB testing capabilities.