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Standard of Excellence: The Perfect PCB Fab—A Vision for Five Years AheadKyocera International Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System
September 27, 2023 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
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