- design007 Magazine
Latest IssuesCurrent Issue
The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
- Events||| MENU
- design007 Magazine
Pivoting on SubstratesSeptember 27, 2023 | I-Connect007 Editorial Team
Estimated reading time: 2 minutes
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
Barry Matties: Since you joined the company, you have been instrumental in defining the direction for PCB Technologies. Could you give us an overview of the company’s current strategic direction?
Oved Shapira: When I joined the company, I first asked where we were heading and where the market was going. For our major customers, what were their projected unmet needs? I asked our CTO to talk with the CTOs of our major customers as a way to develop a multi-industrial vision with advanced technology included.
Of course, when you ask CTOs about their unmet needs, you get much feedback from different angles. When you filter out all the feedback, we found three major issues that keep repeating.
Matties: What were those issues?
Shapira: First was miniaturization. Second was heat dissipation management, which is very much connected to the miniaturization of more functionalities and the growing demand for high-power applications. The third was the registration of mixed materials.
Registration is one of the larger causes of failure on the PCB, Everything that involves multilayer and sub-lamination always has the risk of poor registration. That creates shorts or other quality issues. So, we came back to the drawing board with what we learned.
I joined after the largest private equity fund in Israel acquired the company. We had a favorable cash situation and decided to invest the capital in technologies that would serve miniaturization, heat dissipation, and registration. That’s when we built a strategy of all-in-one. You can have a PCB shop, an assembly service, and advanced packaging of multi-chip modules or SIP (system in package).
So, we upgraded the PCB shop to PCB-like substrates. Today, we can go for a pitch of 50 microns, line space of 25/25, or 20/30.
We create a unique design of organic substrates by integrating copper-moly-copper. We give them a solution for heat dissipation and heat management in combination with miniaturization. Then, we add to the substrate all our capabilities in PCBs.
To read the rest of this interview, which appeared in the September 2023 issue of PCB007 Magazine, click here.
November’s issue of Design007 Magazine had an excellent theme that evolved around design simplification. There were exceptionally good articles about how to reduce over-constrained or needlessly complex designs. One significant time-consuming category is the creation of many design files and drawings which lead to lengthy creation and interpretation time along with the considerable time to resolve conflicting or erroneous information.
On May 11, 2023, Reps. Blake Moore (R-UT) and Anna Eshoo (D-CA) introduced the Protecting Circuit Boards and Substrates (PCB) Act to Congress. In October, I had the great pleasure of discussing the bipartisan Protecting Circuit Boards and Substrates Act with Congressman Moore, who represents Utah’s First Congressional District. He shared his thoughts on how supporting and investing in the domestic PCB industry can help bolster American security.
While previous industrial revolutions have introduced factories, mass production, and computer-controlled systems, the advent of Industry 4.0 and the concept of the Smart factory have ushered in a new era in PCB manufacturing. For the PCB industry it is a very ambitious and aspirational objective to evolve from disconnected processes to an integrated system with automated data capture, real-time data analysis, process visualization, autonomous control, and self-correcting processes.
IPC announced the October 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.97.
Schweitzer Engineering Laboratories (SEL), a global leader in products and solutions that protect and control electric power systems, earned the 2023 Top Project of the Year award by the Idaho Business Review last week at Idaho’s 2023 Top Projects award ceremony in Boise.