-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Pivoting on Substrates
September 27, 2023 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes

Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
Barry Matties: Since you joined the company, you have been instrumental in defining the direction for PCB Technologies. Could you give us an overview of the company’s current strategic direction?
Oved Shapira: When I joined the company, I first asked where we were heading and where the market was going. For our major customers, what were their projected unmet needs? I asked our CTO to talk with the CTOs of our major customers as a way to develop a multi-industrial vision with advanced technology included.
Of course, when you ask CTOs about their unmet needs, you get much feedback from different angles. When you filter out all the feedback, we found three major issues that keep repeating.
Matties: What were those issues?
Shapira: First was miniaturization. Second was heat dissipation management, which is very much connected to the miniaturization of more functionalities and the growing demand for high-power applications. The third was the registration of mixed materials.
Registration is one of the larger causes of failure on the PCB, Everything that involves multilayer and sub-lamination always has the risk of poor registration. That creates shorts or other quality issues. So, we came back to the drawing board with what we learned.
I joined after the largest private equity fund in Israel acquired the company. We had a favorable cash situation and decided to invest the capital in technologies that would serve miniaturization, heat dissipation, and registration. That’s when we built a strategy of all-in-one. You can have a PCB shop, an assembly service, and advanced packaging of multi-chip modules or SIP (system in package).
So, we upgraded the PCB shop to PCB-like substrates. Today, we can go for a pitch of 50 microns, line space of 25/25, or 20/30.
We create a unique design of organic substrates by integrating copper-moly-copper. We give them a solution for heat dissipation and heat management in combination with miniaturization. Then, we add to the substrate all our capabilities in PCBs.
To read the rest of this interview, which appeared in the September 2023 issue of PCB007 Magazine, click here.
Suggested Items
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
Voices of the Industry: Alpha Circuit
05/06/2025 | Marcy LaRont, PCB007 MagazinePrashant Patel, founder and president of Alpha Circuit, takes a pragmatic approach to doing business: “Commerce always wins out,” he says. How will potential tariffs and shifts in the economy affect PCB manufacturing? Prashant offers sound advice.