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IPC Unveils New Training Courses and Subscription Model for the Electronics Workforce
September 28, 2023 | IPCEstimated reading time: 1 minute
IPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs. This collaboration includes expanding its course offerings to include self-paced courses on soldering, inspection, and manufacturing engineering. With the introduction of eight new training courses in 2023, IPC reaffirms its commitment to ensuring that professionals in electronics manufacturing remain at the forefront of the industry.
Introducing the Subscription Model
To enable organizations to invest in efficient employee training across their organizations, IPC now offers an annual subscription model. This approach simplifies the acquisition process making it easier for trainers to assign and review training results, while mitigating the training costs of turnover. By choosing IPC's subscription, organizations can onboard employees more cost effectively and leverage a highly skilled and trained workforce as their competitive edge by providing an environment where all employees can improve their skillsets and knowledge.
Eight New Self-Paced Courses
- Fundamentals of PCB Fabrication & Assembly - An in-depth dive into PCB and PCA fabrication.
- Inspection of Electronic Assemblies: Introduction - Providing the necessary tools and methods for effective incoming inspections.
- Manufacturing Engineering for Electronics Assembly Series - Covering essential topics like Stencil Printing, Surface Mount Technology, and Through-hole Assembly.
- Self-Paced Troubleshooting and Defect Analysis of PCBs - A special course in collaboration with IPC Hall of Famer, Mike Carano, catering to learners worldwide with 24/7 accessibility.
- Soldering for Electronics Assembly: Introduction - A novel hybrid course allowing learners to move at their own pace while also providing hands-on exercises.
The Future of IPC Training
David Hernandez, vice-president of education at IPC said, “We’re dedicated to continuously aligning training solutions with industry needs. Regular engagement with IPC members and industry subject-matter experts ensures that the training remains relevant and is co-developed with the industry’s best minds.
“Now employers can build career pathways with IPC training courses that can develop operators into inspectors or onboard engineers new to electronics manufacturing. IPC believes training is critical to success in the fast-paced world of electronics and so do the thousands of trainers and trainees that have engaged the IPC EDGE learning platform since its launch.”
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Sweeney Ng - CEE PCBSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
                                         Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing Designers Notebook: Power and Ground Distribution Basics
                                         Designers Notebook: Power and Ground Distribution Basics Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
                                         Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics





 
                     
                 
                    