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ViTrox: Elevate Your Tray-Based Inspections with our Latest Configuration – the AUX 4S+ Inspection Module
October 2, 2023 | ViTroxEstimated reading time: 3 minutes
Curious about how Integrated Circuit (IC) manufacturers keep pace with fast-changing technology? Discover how automated systems are revolutionising the semiconductor industry, enhancing production efficiency and cost-effectiveness.
ViTrox, which aims to be the world’s most trusted technology company, is thrilled to introduce a game-changing addition to our advanced machine vision inspection solutions: the 4-sided Auxiliary (AUX 4S+) Inspection Module. This exciting optional add-on feature is designed with our customers' needs in mind and is set to elevate the capabilities of Tray-to-Tray Vision Inspection Handler – TH3000i and Tray-to-Tape & Reel Vision Inspection Handler – TR3000i.
Our Tray-Based Vision Handlers, the TH3000i and the TR3000i are high-quality machine vision inspection solutions that support emerging industries like 5G, IoT, Automotive, and Industry 4.0, with the main difference being their handling mechanism. Both tray-based handlers are designed to support inspection capabilities that accommodate IC package sizes up to 120 mm x 120 mm, including BGA, QFP, QFN, CSP, TSSOP, MSOP, and SOP. In addition, both solutions offer an array of benefits, such as high-speed IC inspection, easy operation, quick conversion time, and low maintenance cost.
The auxiliary module inspection function enables more precise defect detection that occurs at the sides of the semiconductor device. This is achieved via dedicated optics, lighting and software algorithms. The optional advance inspection function is particularly beneficial for customers who demand stringent product quality, especially for automotive, computing, and telecommunications end-applications.
The AUX 4S+ elevates electronics manufacturing to the next level by providing a comprehensive 4-sided inspection solution. It's all about ensuring the highest quality and reliability of customers’ electronic components. Explore the awe-inspiring capabilities of the AUX 4S+ showcased below.:
● Enhanced Inspection Capabilities
The AUX 4S+, built upon an innovative design concept, goes beyond conventional inspection capabilities. In addition to the bottom and side vision station, it features an additional vision module dedicated to performing direct side view inspections on specialised devices like Power Devices, Land Grid Array (LGA), and Ball Grid Array (BGA) with Metal Lid components. This advanced hardware concept incorporates high-performance cameras, precision lighting, and motorised focusing mechanisms, ensuring adaptability across a wide range of package sizes. Furthermore, its cutting-edge software concept employs advanced algorithms tailored for intricate inspections. As a result, the AUX 4S+ significantly enhances inspection capabilities, meticulously inspecting products from all angles, reducing the risk of unnoticed defects, and ultimately upholding the highest standards of quality and reliability.
● Seamless Integration
Designed for seamless integration with your TH3000i and TR3000i models, the AUX 4S+ offers vision-enabled flexibility and ease of use in inspection processes. This integration streamlines workflow by harnessing the power of advanced vision technology. It reduces downtime and minimises manual intervention, resulting in faster and more efficient inspections. This vision-enabled workflow optimisation allows users to meet production schedules, reduce operational costs, and deliver products to customers with uncompromised quality.
● Comprehensive Inspection Coverage
The existing TH3000i and TR3000i solutions offer 3D vision inspection, Leaded Packages Inspection, Ball Packages Inspection, Leadless Packages Inspection, Top 3D POP Inspection, 2D Barcode Inspection, Mark Inspection, Package Vision Inspection, Passive Component Inspection, and 6-sided (6S) Colour Inspection. By adding the AUX 4S+ vision inspection module, users can now comprehensively cover a wide range of inspection items, including side package defects, Lid Gap inspection, Package Height inspection, and more. With the advanced vision capabilities to ensure meticulous inspection of every detail, users can save initial costs of investments as they can now rely on one solution for various inspections.
● Versatile Package Size and Thickness Support
Another significant advantage of the AUX 4S+ vision inspection module is its versatility when it comes to accommodating component sizes. From compact 2x2 mm to spacious 120x120 mm packages, the system seamlessly adapts with minimal need for conversion kits. Additionally, it offers automated conversion, effortlessly transitioning between these diverse package sizes. This not only simplifies users’ inspection operations but also minimises the need for costly specialised equipment. As a result, it improves production efficiency and keeps the operational cost to a minimum.
At ViTrox, we are dedicated to empowering users with cutting-edge solutions to enhance product quality and manufacturing efficiency. The AUX 4S+ is the latest testament to our commitment to innovation and excellence; it's a game-changer for electronics manufacturing processes.
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New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.