-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Advanced Quality Control from Viscom at NEPCON Asia 2023 in Shenzhen
October 2, 2023 | Viscom AGEstimated reading time: 1 minute
Printed circuit board assemblies (PCBAs) and integrated circuits (ICs) are the focus of NEPCON Asia, which will be held October 11-13, 2023, in Shenzhen, China's southern hub of electronics innovation. Germany's Viscom AG will be represented by a select Asian team and four of its many advanced inspection systems: S3088 ultra chrome for 3D SPI, S3088 ultra chrome as a 3D AOI configuration, iX7059 PCB Inspection XL from Viscom's large 3D AXI portfolio, and the X8011-III 3D MXI system.
Viscom inspection systems can be integrated into location-independent, networked processes and provide new quality-relevant insights through the use of artificial intelligence and a variety of customized algorithms. All of this can be explored in detail at the Shenzhen World Exhibition & Convention Center (Baoan New Hall) at the Viscom booth No. 5D20. Solder paste inspection with an orthogonal optical resolution of 10 μm/pixel and a height resolution of 0.1 µm/pixel is combined with four angular views to deliver perfect, shadow-free inspection results. Automatic post-reflow optical inspection with the S3088 ultra chrome system even offers nine perspectives, true-to-life spatial renderings, and exceptionally high throughput in large production areas.
For inline X-ray, customers can choose from a well-designed Viscom product family, depending on their individual inspection needs. Whether for PCBAs with a length of up to 1600 mm or heavy assembled objects weighing up to 40 kg – the iX7059 series offers suitable configurations. For special tasks such as the inspection of IGBT modules with their ICs for power electronics applications, a 180 kV X-ray tube is available as a component. Different layers of the inspection object can be analyzed with highest precision.
Where speed is far less important than particularly brilliant resolution of X-ray results, the 3D-MXI Viscom System X8011-III comes into play. The thorough analysis of prototypes, the inspection of product complaints or the quality control of small batches are three of many examples of intelligent and effective use of its technological capabilities. Automatic reports and networked comparisons of the X8011-III’s X-ray images with inline results from other machines round out this special offering.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young America Marks 15 Years Helping Electronics Manufacturers Shift from Defect Detection to Process Control
01/14/2026 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, today recognized a major milestone for its Americas organization.
Voices of the Industry Podcast Explores the Evolving Role of Inspection Systems in EMS Manufacturing
01/05/2026 | I-Connect007Inspection technology continues to play a pivotal role in the evolution of electronics manufacturing services, and the latest episode of Voices of the Industry brings that conversation into sharp focus. Hosted by I-Connect007’s Nolan Johnson, this episode features Joel Scutchfield of Koh Young, a recognized leader in 3D measurement-based inspection systems.
What’s Driving the Market in Inspection Equipment
12/22/2025 | Nolan Johnson, SMT007 MagazineAt SMTAI 2025, we polled several automated inspection experts to learn more about their market and emerging customer needs. Among others, we spoke with Nick Fieldhouse, OEI product manager for automated inspection systems, Omron, and Allen Phung, head of sales, America, Koh Young America. We asked them about the current market drivers for automated inspection, including AOI, SPI, and AXI, and sought more details about trends in inspection using artificial intelligence and machine learning.
TRI's AI-Powered Test and Inspection Solutions at APEX EXPO 2026
12/19/2025 | TRITest Research, Inc. (TRI) will join the APEX EXPO 2026 held at Anaheim Convention Center on March 17 – 19, 2026. Visit TRI at booth #2833 to experience TRI's latest AI-Powered Inspection Solutions.
Lockheed Martin, Hadrian Collaborate to Advance Manufacturing Capabilities
12/15/2025 | Lockheed MartinLockheed Martin and Hadrian have entered into a Memorandum of Understanding to accelerate the pace and value of advanced American manufacturing at Lockheed Martin, building a more resilient and scalable industrial base.