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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026

04/23/2026 | Remtec
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

Smart Automation: The Journey of a Component Through an SMT Factory

04/22/2026 | Josh Casper -- Column: Smart Automation
In electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.

Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

04/20/2026 | Marcy LaRont, I-Connect007
The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026

04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007
Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

04/16/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
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