The New Chapter: Navigating Maternity Leave in the Electronics Industry
American Made Advocacy: There's No Substitute for American-made Microelectronics
It’s Only Common Sense: When Will Big Companies Start Paying Their Bills on Time?
iNEMI LTS Tech Topic Series: Electromigration in Tin-Bismuth Planar Solder Joints
October 10, 2023 | iNEMIEstimated reading time: 1 minute
iNEMI is launching a series of webinars focused on low temperature solder (LTS). This first webinar in the series will share information from Phase 1 of iNEMI’s Electromigration in SnBi Solder for Second-Level Interconnect project, which is determining the effects of joint height, temperature, current density and PCB finishes on reliability over a product’s life.
The low melting temperature (138°C) of SnBi alloys make it attractive for assembling high-density microelectronic packaging, which is prone to warpage. However, bismuth (Bi) has a high propensity for electromigration and segregation at the anode under high current density conditions, leading to potentially brittle solder joints with high electrical resistance with time in field.
The Phase 1 project team used a planar geometry solder joint test vehicle to study electromigration in low temperature solders such as SnBi. The novelty of their approach is that the planar solder joints bridging copper traces on printed circuit boards allow the metallurgical and electromigration phenomena to be directly and non-destructively observed while monitoring the resistance changes in the solder joints. This webinar will share the team’s observations and analysis of experiment results plus talk about next steps.
Registration
This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content).
Session 1
Tuesday, October 17, 2023
10:00-11:00 a.m. EDT (Americas)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Session 2
Wednesday, October 18, 2023
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on October 17
Share on:
Suggested Items
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Cicor Unveils Strategy 2028 to Lead as Pan-European Electronics Innovator
11/05/2024 | CicorCicor Group announces its Strategy 2028 as well as updated financial mid-term targets and is hosting its Investors' Day 2024 in Zurich this evening.
INSPECTIS AB Launches Series U50 at Electronica 2024
11/04/2024 | INSPECTISINSPECTIS AB announces the launch of its Series U50 digital camera microscope, a 4K system boasting 60 FPS for applications where ultra-high resolution is needed for fast-moving inspection or live working tasks.
SEMI Europe Announces 2024 20 Under 30 Awards Celebrating Innovation and Leadership
11/04/2024 | SEMISEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced the 2024 20 Under 30 Award Recipients, honoring exceptional young professionals who are driving innovation and success in the semiconductor industry.
IBIDEN Reports Strong Q2 Financial Performance for FY2024
11/04/2024 | IBIDENIBIDEN Co., Ltd. released its Q2 FY2024 financial report, showcasing solid growth across its core business segments. Net sales reached ¥181.6 billion, a slight decrease from the previous year, while the electronics segment reported a 4.2% drop due to market adjustments.