Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Koh Young Highlighting Award-winning True3D Inspection Solutions at SMTA Guadalajara Expo
October 10, 2023 | Koh Young TechnologyEstimated reading time: 3 minutes
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will deliver live demonstrations of its award-winning inspection machines and smart factory software during the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico on October 25-26, 2023. Additionally, Heriberto Cuevas, Regional Sales Manager for Mexico will take part in a roundtable about the application of artificial intelligence for automated optical inspection. The following previews what Koh Young will demonstrate at the show:
Solder Paste Inspection (SPI)
We introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process.
- ·KY8030-3 Industry’s Fastest True 3D SPI Solution with Integrated Auto-Repair Dispenser
Printing Process Optimization
The Koh Young Process Optimizer (KPO) solution is an AI-based automatic print process optimizer. This system improves the printer offset, as well as critical printer parameters like squeegee speed, print pressure, and separation speed. KPO performs an automated DOE to determine the optimum printing parameters for the best print quality. As a result, manufacturers can optimize the print process, without the need for a dedicated print process expert. Furthermore, KPO monitors and perfects parameters in real-time to guarantee quality despite environmental changes.
- KPO Printer Award-winning AI-powered print process control software
Automated Optical Inspection (AOI)
The Koh Young AOI Zenith Series delivers perfect inspection performance with True 3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True 3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.
- Zenith Alpha Best Value True 3D Automated Optical Inspection Solution
Dispense Process Inspection (DPI)
The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.
- Neptune C+ Award-winning True 3D In-Line Dispensing Process Inspection (DPI) Solution
Automated Pin Inspection (API)
Incomparable 3D Inspection Capability. The KY-P3 quickly and accurately measures pin height for presence, absence, offset, coplanarity, tip and shoulder height, absolute/relative critical distance measurement, fork pin separation, and spacing pitch. Built on its world-class True3D inspection technology, the KY-P3 Series breaks through barriers associated with inspecting products containing a mix of both SMDs and pins.
- KY-P3 Best-in-class Measurement Accuracy and Inspection Reliability
Process Control Software
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes.
- KSMART Seamless Smart Factory Software Suite Turning Data into Insights
To learn more about how our solutions boost your quality, visit us at the SMTA Guadalajara Expo & Tech Forum during 25-26 October 2023 at the EXPO Guadalajara in Jalisco, Mexico.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.