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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 13, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

It was fun while it lasted. The Braves broke dozens of records this year, but the Phillies beat them in four games in the National League Division Series. The Phillies did the same thing last year; they seem to have found our “sweet spot.”
While we’re on the subject of sweet spots, in this week’s Top 5, we start with a conversation with Mike Soble, who explains why SEL and Chemcut have such a great partnership. We have a review of SMTA International, which took place this week in Minneapolis. We also have a conversation with the design team at Monsoon Solutions; they explain how they geared their documentation process to the requirements of IPC standards. Mike Morando explains how to qualify your rigid-flex manufacturer. And we have an announcement about the IPC Checklist, a very useful document that I-Connect007 recently published. Check out the checklist.
Have a great weekend!
Chemcut: Blending Capabilities and Culture
Published October 9
Schweitzer Engineering Laboratories recently installed a variety of Chemcut machines at the new SEL facility in Moscow, Idaho. In this wide-ranging interview, Chemcut’s Mike Soble explains why their partnership with SEL is such a good match for both companies.
SMTA International 2023 Kicks Off In Minneapolis
Published October 11
SMTA International was held this week in Minneapolis, and the I-Connect007 team was there, meeting with the top engineers and managers of the EMS industry. Check out Editor Nolan Johnson’s review of the show, which was co-located with the MDM&A advanced manufacturing show.
A Standards-driven Design Environment
Published October 12
If you’re designing to IPC standards, this interview is for you. The design bureau Monsoon Solutions has set up its internal documentation systems around the relevant IPC standards, and Jen Kolar and Cory Grunwald walk us through the details.
Selecting a Rigid-flex Manufacturer
Published October 9
With rigid-flex circuits popping up in every segment of the market now, more PCB designers are moving into rigid-flex design every year. In this article, PFC Flexible Circuits’ Mike Morando discusses what you need to know before you start your search for a rigid-flex fabrication partner.
IPC Checklist Has It All
Published October 12
Speaking of standards, I-Connect007 has just published the IPC Checklist, a handy document that explains which standards cover each segment of the industry, from design through assembly, and much more. This document should be required reading for all new hires.
Suggested Items
New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
06/19/2025 | Marcy LaRont, I-Connect007IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
LSI ADL Technology Leverages IPC Membership for Growth, Training, and Industry Leadership
05/28/2025 | Michelle Te, IPC CommunityWhether attending the EMS Leadership Summit at IPC APEX EXPO, or subscribing to workforce training, LSI ADL Technology has noted several positive changes directly related to its IPC membership. “Collaboration, brainstorming, and sharing best practices have been the most important aspects of our partnership with IPC,” says Jonathan Verity, assistant general manager at LSI ADL Technology.
TT Electronics' Cleveland Ohio Facility Re-Certified to Aerospace and Defence Standards AS9100 and Nadcap
05/23/2025 | TT ElectronicsTT Electronics has successfully completed recertification of the Cleveland facility to AS9100 and Nadcap standards. This milestone underscores the company’s unwavering dedication to quality in manufacturing for the aerospace and defence sectors, a commitment proudly upheld for more than 15 years.
IPC-CFX, 2.0: Expanding the Digital Backbone of Electronics Manufacturing
05/21/2025 | Chris Jorgensen, IPCSince its initial release in March 2019, IPC Connected Factory Exchange (CFX), the global standard for plug-and-play, machine-to-machine, and machine-to-system communication serving as the backbone for digital manufacturing, has seen continuous enhancement through multiple version updates. In 2024, the standard matured as adoption spread, with a global committee of EMS, OEM, machine vendors, and software solution providers twice releasing version updates to build on the standard's base framework and enhance its usability in industry.