Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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Fall Issue of IPC Community Now Available
October 16, 2023 | IPC Community Editorial TeamEstimated reading time: 1 minute
IPC Community launches its fall issue today, with more than 100 pages of must-read content that spans the globe to bring you compelling stories, conversations, fun facts, coverage of recent IPC events, and more.
Click here to get your personalized copy of IPC Community.
What’s inside this issue? Here's just a few of the stories you'll read:
- Hear from Tibi Baranyi of Flex Romania, whose interests range from helping set IPC standards to martial arts to fishing on the Danube Delta.
- Brian Chislea is a chemist for Dow Chemical who spends his off hours helping bring up the next generation through the local FIRST Robotics team.
- IPC Chief Economist Shawn DuBravac keeps an eagle eye on the world economy and has some interesting insights into the latest developments in interest rates.
- IPC was in India for IEMI and we’ve collated a photo gallery you don’t want to miss.
This issue also includes class schedules for instructor-led courses, updates on the latest standards, a profile on WHMA member Stark Electronics/Absolute Quality Manufacturing, skills team development and training in China, and an exciting new offering from the IPC Education Team.
See your friends—and make some new ones—in the pages of IPC Community. Peek inside here.
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Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.