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PCB007 Magazine October 2024: Alternate Metallization Processes

10/16/2024 | I-Connect007 Editorial Team
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.

Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation

10/01/2024 | Michael Carano -- Column: Trouble in Your Tank
It has been well documented that, with a very expensive and complex printed circuit board, thermal and mechanical excursions often find weaknesses. A lack of robustness and poor process control often leads to the exploitation of those weaknesses. An interconnect defect (ICD) often goes undetected until the printed circuit board reaches the final assembly stage or undergoes multiple thermal cycles, including interconnect stress tests or thermal shock. It is impossible to rework the ICD defect. But unlike voids, if detected in time, the panels can be reprocessed.

Real Time with... SMTA Guadalajara 2024: AXXON Mycronic Advances Tech in Mexico

09/25/2024 | Real Time with... SMTA Guadalajara
Nolan Johnson speaks with Miguel Gonzalez, sales manager for Mexico. Gonzalez discusses the recent opening of Axxon Mycronic's subsidiary in Mexico, highlighting their new laboratory equipped for testing and developing machinery.

Smartkem, Chip Foundation Partner on MicroLED Backlight Tech

09/10/2024 | PRNewswire
Smartkem, a company that has the potential to power the next generation of displays using its disruptive organic thin-film transistors (OTFTs), announced that it has entered into a joint development agreement with Shanghai Chip Foundation Semiconductor Technology Co., Ltd., a manufacturer of semiconductor and integrated circuit devices, to co-develop a new generation of microLED-based backlight technology for Liquid Crystal Displays.

DELO Proves Feasibility of Adhesives as Soldering Alternatives for MiniLEDs, Predicting Future MicroLED Integration

09/09/2024 | DELO
DELO has conducted in-house feasibility studies, electrically and mechanically connecting miniLED dice using directional conductive adhesives.
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