Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Real Time with... SMTAI 2023: Underfilm: The New 20-Year-Old Assembly Solution
October 17, 2023 | Real Time with...SMTAIEstimated reading time: Less than a minute
Underfilm is an alternative for underfill. Alltemated holds a patent for this technology which they've been perfecting for 20 years. Rachael Temple, sales and marketing, explains how it works, when to use it, and why you should.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in